{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,4]],"date-time":"2026-04-04T17:42:22Z","timestamp":1775324542799,"version":"3.50.1"},"reference-count":24,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2025,2,1]],"date-time":"2025-02-01T00:00:00Z","timestamp":1738368000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,2,1]],"date-time":"2025-02-01T00:00:00Z","timestamp":1738368000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,2,1]],"date-time":"2025-02-01T00:00:00Z","timestamp":1738368000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52077183"],"award-info":[{"award-number":["52077183"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52372364"],"award-info":[{"award-number":["52372364"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100004543","name":"China Scholarship Council","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100004543","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2025,2]]},"DOI":"10.1109\/tie.2024.3423328","type":"journal-article","created":{"date-parts":[[2024,8,6]],"date-time":"2024-08-06T18:00:50Z","timestamp":1722967250000},"page":"1412-1421","source":"Crossref","is-referenced-by-count":6,"title":["Simultaneous Wireless Power and Data Transfer System With Full-Duplex Mode Based on Half-Cycle OFDM"],"prefix":"10.1109","volume":"72","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-4071-3729","authenticated-orcid":false,"given":"Yongzhi","family":"Jing","sequence":"first","affiliation":[{"name":"Key Laboratory of Magnetic Suspension Technology and Maglev Vehicle, Ministry of Education, Chengdu, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5319-8204","authenticated-orcid":false,"given":"Kang","family":"Fu","sequence":"additional","affiliation":[{"name":"Tangshan Graduate School of Southwest Jiaotong University, Tangshan, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0006-2153-2577","authenticated-orcid":false,"given":"Jialong","family":"Yu","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Southwest Jiaotong University, Chengdu, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0005-3946-3760","authenticated-orcid":false,"given":"Xinjie","family":"Dan","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Southwest Jiaotong University, Chengdu, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0007-4331-7402","authenticated-orcid":false,"given":"Sheng","family":"Ni","sequence":"additional","affiliation":[{"name":"Tangshan Graduate School of Southwest Jiaotong University, Tangshan, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7335-8503","authenticated-orcid":false,"given":"Suleiman M.","family":"Sharkh","sequence":"additional","affiliation":[{"name":"Department of Mechanical Engineering, University of Southampton, Southampton, U.K."}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/tie.2022.3204857"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2020.3005332"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/tie.2022.3215828"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/tpel.2018.2881285"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/tpel.2022.3179979"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2022.3222011"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2022.3203038"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2021.3117854"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2023.3303419"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2015.2453934"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/PerCom.2013.6526721"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2023.3303419"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2023.3261887"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2020.3031518"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2831196"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2497739"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.3035782"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2021.3126337"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2022.3203038"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2022.3225320"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2019.2909303"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2020.2967023"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TCOM.1968.1089889"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.3010308"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/41\/10836960\/10627931.pdf?arnumber=10627931","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,13]],"date-time":"2025-01-13T19:53:25Z","timestamp":1736798005000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10627931\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,2]]},"references-count":24,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tie.2024.3423328","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"value":"0278-0046","type":"print"},{"value":"1557-9948","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,2]]}}}