{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,11]],"date-time":"2026-02-11T00:45:25Z","timestamp":1770770725211,"version":"3.50.0"},"reference-count":33,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2026,2,1]],"date-time":"2026-02-01T00:00:00Z","timestamp":1769904000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,2,1]],"date-time":"2026-02-01T00:00:00Z","timestamp":1769904000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,2,1]],"date-time":"2026-02-01T00:00:00Z","timestamp":1769904000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52507046"],"award-info":[{"award-number":["52507046"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Stable Support Plan in Shenzhen","award":["GXWD20220811151734002"],"award-info":[{"award-number":["GXWD20220811151734002"]}]},{"DOI":"10.13039\/501100021171","name":"Basic and Applied Basic Research Foundation of Guangdong Province","doi-asserted-by":"publisher","award":["2023A1515010069"],"award-info":[{"award-number":["2023A1515010069"]}],"id":[{"id":"10.13039\/501100021171","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100021171","name":"Basic and Applied Basic Research Foundation of Guangdong Province","doi-asserted-by":"publisher","award":["2024A0505040006"],"award-info":[{"award-number":["2024A0505040006"]}],"id":[{"id":"10.13039\/501100021171","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Shenzhen Science and Technology Program","award":["JCYJ20241202123707011"],"award-info":[{"award-number":["JCYJ20241202123707011"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2026,2]]},"DOI":"10.1109\/tie.2025.3598176","type":"journal-article","created":{"date-parts":[[2025,10,27]],"date-time":"2025-10-27T17:58:03Z","timestamp":1761587883000},"page":"1714-1725","source":"Crossref","is-referenced-by-count":0,"title":["Improved Observer-Free Deadbeat Control of SPMSM for Dynamic Performance Optimization"],"prefix":"10.1109","volume":"73","author":[{"ORCID":"https:\/\/orcid.org\/0009-0000-4473-4100","authenticated-orcid":false,"given":"Ruibin","family":"Niu","sequence":"first","affiliation":[{"name":"School of Mechanical Engineering and Automation, Harbin Institute of Technology (Shenzhen), Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5209-2996","authenticated-orcid":false,"given":"Jincheng","family":"Yu","sequence":"additional","affiliation":[{"name":"School of Mechanical Engineering and Automation, Harbin Institute of Technology (Shenzhen), Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-3487-7957","authenticated-orcid":false,"given":"Cheng","family":"Tang","sequence":"additional","affiliation":[{"name":"China Nuclear Power Technology Research Institute, Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0002-5327-2539","authenticated-orcid":false,"given":"Wenjiang","family":"Zhu","sequence":"additional","affiliation":[{"name":"China Nuclear Power Technology Research Institute, Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-0696-8593","authenticated-orcid":false,"given":"Changning","family":"Li","sequence":"additional","affiliation":[{"name":"School of Mechanical Engineering and Automation, Harbin Institute of Technology (Shenzhen), Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-7419-8548","authenticated-orcid":false,"given":"Minglang","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Mechanical Engineering and Automation, Harbin Institute of Technology (Shenzhen), Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0004-4299-9243","authenticated-orcid":false,"given":"Mingming","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Mechanical Engineering and Automation, Harbin Institute of Technology (Shenzhen), Shenzhen, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2021.3121532"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2009.2014904"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2652338"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TVT.2020.3043474"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1049\/cp.2014.0351"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/28.370284"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2021.3063226"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2010.2101994"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/DDCLS58216.2023.10166256"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2019.2943016"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2007.891767"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2022.3196367"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/tte.2024.3392907"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TVT.2017.2752778"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2022.3195702"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2016.2602853"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2022.3192883"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2016.2592534"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2022.3177808"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TEC.2018.2867218"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1080\/00207179.2013.810345"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2013.2253065"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2020.2970660"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TEC.2020.3009119"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2023.3279526"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.23919\/CJEE.2023.000020"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2023.3283711"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2024.3511085"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2023.3260344"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/ACC.2003.1242516"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2022.3216513"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2024.3519592"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2019.2908380"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/41\/11385824\/11217321.pdf?arnumber=11217321","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,2,10]],"date-time":"2026-02-10T21:05:50Z","timestamp":1770757550000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11217321\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,2]]},"references-count":33,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tie.2025.3598176","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"value":"0278-0046","type":"print"},{"value":"1557-9948","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,2]]}}}