{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,12]],"date-time":"2026-10-12T16:31:33Z","timestamp":1791822693946,"version":"4.3.4"},"reference-count":59,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2021,1,1]],"date-time":"2021-01-01T00:00:00Z","timestamp":1609459200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,1,1]],"date-time":"2021-01-01T00:00:00Z","timestamp":1609459200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,1,1]],"date-time":"2021-01-01T00:00:00Z","timestamp":1609459200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans.Inform.Forensic Secur."],"published-print":{"date-parts":[[2021]]},"DOI":"10.1109\/tifs.2021.3065225","type":"journal-article","created":{"date-parts":[[2021,3,24]],"date-time":"2021-03-24T19:32:41Z","timestamp":1616614361000},"page":"2805-2820","source":"Crossref","is-referenced-by-count":24,"title":["ThermoTag: A Hidden ID of 3D Printers for Fingerprinting and Watermarking"],"prefix":"10.1109","volume":"16","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-6811-0183","authenticated-orcid":false,"given":"Yang","family":"Gao","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3081-7524","authenticated-orcid":false,"given":"Wei","family":"Wang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yincheng","family":"Jin","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chi","family":"Zhou","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6444-9411","authenticated-orcid":false,"given":"Wenyao","family":"Xu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3020-3736","authenticated-orcid":false,"given":"Zhanpeng","family":"Jin","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1039\/D0NR01223H"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1016\/j.addma.2014.07.001"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1145\/2976749.2978300"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1145\/2976749.2978323"},{"key":"ref31","first-page":"22:1","article-title":"Thermal side-channel forensics in additive manufacturing systems","author":"chhetri","year":"2016","journal-title":"Proc 7th ACM\/IEEE Int Conf Cyber-Phys Syst (ICCPS)"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/ICCPS.2016.7479068"},{"key":"ref37","doi-asserted-by":"crossref","first-page":"138","DOI":"10.1145\/2461912.2461936","article-title":"Infrastructs: Fabricating information inside physical objects for imaging in the terahertz region","volume":"32","author":"willis","year":"2013","journal-title":"ACM Trans Graph"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681648"},{"key":"ref35","first-page":"51","article-title":"Hardware trojan detection using path delay fingerprint","author":"jin","year":"2008","journal-title":"Proc IEEE Int Symp Hardw Oriented Secur Trust (HOST)"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1145\/586110.586132"},{"key":"ref28","article-title":"U.S. 3D printer forecast, 2016–2020: New 3D print\/additive manufacturing technologies fuel growth","author":"greene","year":"2016"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1017\/S026357471000069X"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1145\/2689702.2689709"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/3243734.3243735"},{"key":"ref1","article-title":"Additive manufacturing and 3D printing state of the industry","author":"campbell","year":"2019"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1038\/s41570-017-0031"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ICPR.2014.783"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1145\/3061639.3079847"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.14722\/ndss.2014.23059"},{"key":"ref23","article-title":"Mobile device identification via sensor fingerprinting","author":"bojinov","year":"2014","journal-title":"arXiv 1408 1416"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.5539\/jsd.v3n4p17"},{"key":"ref25","article-title":"3D printing: Overview, impacts, and the federal role","author":"sargent","year":"2019"},{"key":"ref50","author":"\u00e5str\u00f6m","year":"2006","journal-title":"Advanced PID Control"},{"key":"ref51","doi-asserted-by":"publisher","DOI":"10.1016\/j.patcog.2008.10.004"},{"key":"ref59","doi-asserted-by":"publisher","DOI":"10.1109\/INTELCIS.2017.8260022"},{"key":"ref58","doi-asserted-by":"publisher","DOI":"10.1109\/TPAMI.1986.4767851"},{"key":"ref57","doi-asserted-by":"publisher","DOI":"10.1109\/TPAMI.2005.126"},{"key":"ref56","doi-asserted-by":"publisher","DOI":"10.1016\/j.addma.2016.12.005"},{"key":"ref55","doi-asserted-by":"publisher","DOI":"10.1109\/TMM.2019.2962306"},{"key":"ref54","doi-asserted-by":"publisher","DOI":"10.1051\/matecconf\/201710402023"},{"key":"ref53","doi-asserted-by":"publisher","DOI":"10.1016\/S0042-6989(97)00169-7"},{"key":"ref52","doi-asserted-by":"crossref","first-page":"504","DOI":"10.1126\/science.1127647","article-title":"Reducing the dimensionality of data with neural networks","volume":"313","author":"hinton","year":"2006","journal-title":"Science"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2013.2293018"},{"key":"ref11","author":"weinberg","year":"2013","journal-title":"What’s the Deal With Copyright and 3D Printing?"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1145\/3214286"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TIFS.2016.2578285"},{"key":"ref13","first-page":"951","article-title":"Cyber-physical vulnerabilities in additive manufacturing systems","volume":"7","author":"sturm","year":"2014","journal-title":"CONTEXT"},{"key":"ref14","first-page":"1181","article-title":"See no evil, hear no evil, feel no evil, print no evil? Malicious fill patterns detection in additive manufacturing","author":"bayens","year":"2017","journal-title":"Proc 26th USENIX Secur Symp"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/3264918"},{"key":"ref16","article-title":"Tool of spies: Leaking your IP by altering the 3D printer compiler","author":"chhetri","year":"2019","journal-title":"IEEE Trans Dependable Secure Comput"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.2971947"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/2756601.2756607"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1145\/311535.311540"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.cad.2015.04.001"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/EMR.2013.6693869"},{"key":"ref6","first-page":"704","article-title":"Medical applications for 3D printing: Current and projected uses","volume":"39","author":"ventola","year":"2014","journal-title":"Pharmacology & Therapeutics"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2014.2311810"},{"key":"ref8","author":"sheynin","year":"2017","journal-title":"A Treat for the AvGeeks An Inside Look at GE’s 3D-Printed Aircraft Engine"},{"key":"ref7","year":"2014","journal-title":"SpaceX Launches 3D-Printed Part to Space Creates Printed Engine Chamber"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1115\/1.2899060"},{"key":"ref9","author":"liptak","year":"2017","journal-title":"The US Navy 3D Printed a Concept Submersible in Four Weeks"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1109\/TIFS.2017.2718482"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/TVCG.2016.2525771"},{"key":"ref48","author":"kays","year":"2012","journal-title":"Convective Heat and Mass Transfer"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1109\/TR.2018.2869303"},{"key":"ref42","doi-asserted-by":"crossref","first-page":"89","DOI":"10.1145\/2775292.2775313","article-title":"Applicability of watermarking for intellectual property rights protection in a 3D printing scenario","author":"macq","year":"2015","journal-title":"Proc 20th Int Conf 3D Web Technol"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1016\/j.cose.2018.12.015"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2006.882111"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/TVCG.2005.71"}],"container-title":["IEEE Transactions on Information Forensics and Security"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10206\/9151439\/09385084.pdf?arnumber=9385084","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T14:52:36Z","timestamp":1652194356000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9385084\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021]]},"references-count":59,"URL":"https:\/\/doi.org\/10.1109\/tifs.2021.3065225","relation":{},"ISSN":["1556-6013","1556-6021"],"issn-type":[{"value":"1556-6013","type":"print"},{"value":"1556-6021","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021]]}}}