{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,23]],"date-time":"2026-06-23T05:21:14Z","timestamp":1782192074894,"version":"3.54.5"},"reference-count":25,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2016,6,1]],"date-time":"2016-06-01T00:00:00Z","timestamp":1464739200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"DOI":"10.13039\/501100002822","name":"Central South University","doi-asserted-by":"publisher","award":["2015CX002"],"award-info":[{"award-number":["2015CX002"]}],"id":[{"id":"10.13039\/501100002822","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002822","name":"Central South University","doi-asserted-by":"publisher","award":["2016CX009"],"award-info":[{"award-number":["2016CX009"]}],"id":[{"id":"10.13039\/501100002822","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100004602","name":"Program for New Century Excellent Talents in University","doi-asserted-by":"publisher","award":["NCET-13-0593"],"award-info":[{"award-number":["NCET-13-0593"]}],"id":[{"id":"10.13039\/501100004602","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100006407","name":"Hunan Provincial Natural Science Foundation of China","doi-asserted-by":"publisher","award":["14JJ3011"],"award-info":[{"award-number":["14JJ3011"]}],"id":[{"id":"10.13039\/501100006407","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Inf."],"published-print":{"date-parts":[[2016,6]]},"DOI":"10.1109\/tii.2016.2557805","type":"journal-article","created":{"date-parts":[[2016,4,22]],"date-time":"2016-04-22T18:25:22Z","timestamp":1461349522000},"page":"1156-1165","source":"Crossref","is-referenced-by-count":93,"title":["A Novel Spatiotemporal LS-SVM Method for Complex Distributed Parameter Systems With Applications to Curing Thermal Process"],"prefix":"10.1109","volume":"12","author":[{"given":"Xinjiang","family":"Lu","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Wei","family":"Zou","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Minghui","family":"Huang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2014.2341955"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.automatica.2009.01.008"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1007\/s11071-015-2201-3"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2014.10.040"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/j.ces.2015.02.021"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1007\/s11071-012-0338-x"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2015.2411438"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2015.2422614"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2015.2389625"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2014.2319216"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TAC.2007.894513"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/s11071-011-9975-8"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1021\/ie301179e"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1137\/040611100"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TNNLS.2014.2382094"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2014.07.061"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.neucom.2015.08.005"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TSMCC.2013.2258337"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2013.2288200"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2013.2263777"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2012.2222652"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2014.2327558"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TNN.2006.875985"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1007\/s11071-014-1736-z"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1016\/j.ces.2009.06.053"}],"container-title":["IEEE Transactions on Industrial Informatics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9424\/7484223\/07458191.pdf?arnumber=7458191","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:10:48Z","timestamp":1642003848000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7458191\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,6]]},"references-count":25,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/tii.2016.2557805","relation":{},"ISSN":["1551-3203","1941-0050"],"issn-type":[{"value":"1551-3203","type":"print"},{"value":"1941-0050","type":"electronic"}],"subject":[],"published":{"date-parts":[[2016,6]]}}}