{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,13]],"date-time":"2026-03-13T06:59:15Z","timestamp":1773385155663,"version":"3.50.1"},"reference-count":31,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2018,12,1]],"date-time":"2018-12-01T00:00:00Z","timestamp":1543622400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["51675250"],"award-info":[{"award-number":["51675250"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["51705203"],"award-info":[{"award-number":["51705203"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100004608","name":"Natural Science Foundation of Jiangsu Province","doi-asserted-by":"publisher","award":["BK20160183"],"award-info":[{"award-number":["BK20160183"]}],"id":[{"id":"10.13039\/501100004608","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Inf."],"published-print":{"date-parts":[[2018,12]]},"DOI":"10.1109\/tii.2018.2839614","type":"journal-article","created":{"date-parts":[[2018,5,22]],"date-time":"2018-05-22T19:10:57Z","timestamp":1527016257000},"page":"5620-5628","source":"Crossref","is-referenced-by-count":50,"title":["Detection of Micro Solder Balls Using Active Thermography Technology and <italic>K<\/italic>-Means Algorithm"],"prefix":"10.1109","volume":"14","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-2932-0185","authenticated-orcid":false,"given":"Xiangning","family":"Lu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhenzhi","family":"He","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Lei","family":"Su","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mengying","family":"Fan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Fan","family":"Liu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Guanglan","family":"Liao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tielin","family":"Shi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref31","first-page":"1","article-title":"Thermographic image processing for NDT","volume":"79","author":"ibarra-castanedo","year":"0","journal-title":"Proc IV Conferencia Panamericana de END"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.3166\/qirt.3.219-230"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2002.1010010"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2015.09.009"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.ndteint.2016.08.003"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2016.08.010"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2017.10.029"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2013.2262500"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2012.2226033"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.ymssp.2016.09.030"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2015.09.030"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2014.09.006"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1117\/1.1566969"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1115\/1.4034037"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1016\/j.phpro.2012.03.206"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1063\/1.2747673"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2016.2643694"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1016\/j.infrared.2004.03.011"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2016.2615273"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICRMS.2014.7107124"},{"key":"ref7","first-page":"1","article-title":"Optical inspection technologies for 3D packaging","author":"aiyer","year":"2015","journal-title":"Chip Scale Review"},{"key":"ref2","first-page":"59","article-title":"The role of packaging in microelectronics","author":"morris","year":"0","journal-title":"Fundamentals of Microsystem Packaging"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2014.2359416"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.4071\/imaps.348081"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/j.ndteint.2011.05.003"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1007\/s11431-015-5896-y"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/j.infrared.2013.12.019"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.infrared.2017.01.008"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1016\/j.infrared.2015.08.001"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/j.seta.2014.09.001"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2011.12.028"}],"container-title":["IEEE Transactions on Industrial Informatics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9424\/8558633\/08362749.pdf?arnumber=8362749","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,27]],"date-time":"2022-01-27T03:18:09Z","timestamp":1643253489000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8362749\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,12]]},"references-count":31,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tii.2018.2839614","relation":{},"ISSN":["1551-3203","1941-0050"],"issn-type":[{"value":"1551-3203","type":"print"},{"value":"1941-0050","type":"electronic"}],"subject":[],"published":{"date-parts":[[2018,12]]}}}