{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,12]],"date-time":"2026-05-12T12:33:03Z","timestamp":1778589183249,"version":"3.51.4"},"reference-count":34,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"7","license":[{"start":{"date-parts":[[2020,7,1]],"date-time":"2020-07-01T00:00:00Z","timestamp":1593561600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,7,1]],"date-time":"2020-07-01T00:00:00Z","timestamp":1593561600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,7,1]],"date-time":"2020-07-01T00:00:00Z","timestamp":1593561600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["U1713206"],"award-info":[{"award-number":["U1713206"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Basic Research Key Project of Shenzhen Science and Technology Plan","award":["JCYJ20170811160003571"],"award-info":[{"award-number":["JCYJ20170811160003571"]}]},{"name":"Basic Research Key Project of Shenzhen Science and Technology Plan","award":["JCYJ20170413152535587"],"award-info":[{"award-number":["JCYJ20170413152535587"]}]},{"name":"Basic Research Project of Shenzhen Science and Technology Plan","award":["JCYJ20170413112645981"],"award-info":[{"award-number":["JCYJ20170413112645981"]}]},{"name":"Basic Research Project of Shenzhen Science and Technology Plan","award":["JCYJ20170307151848226"],"award-info":[{"award-number":["JCYJ20170307151848226"]}]},{"name":"International Cooperative Research Project of Shenzhen Collaborative Innovation Program","award":["GJHZ20180928154402130"],"award-info":[{"award-number":["GJHZ20180928154402130"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Inf."],"published-print":{"date-parts":[[2020,7]]},"DOI":"10.1109\/tii.2019.2950496","type":"journal-article","created":{"date-parts":[[2019,11,6]],"date-time":"2019-11-06T21:12:08Z","timestamp":1573074728000},"page":"4403-4412","source":"Crossref","is-referenced-by-count":16,"title":["Cascaded Approach to Defect Location and Classification in Microelectronic Bonded Joints: Improved Level Set and Random Forest"],"prefix":"10.1109","volume":"16","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-2552-3575","authenticated-orcid":false,"given":"Zhili","family":"Long","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xing","family":"Zhou","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4988-5420","authenticated-orcid":false,"given":"Xiaojun","family":"Wu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref33","first-page":"281","article-title":"Random search for hyper-parameter optimization","volume":"13","author":"bergstra","year":"2012","journal-title":"J Mach Learn Res"},{"key":"ref32","first-page":"225","article-title":"A multi-class SVM classifier utilizing binary decision tree","volume":"33","author":"madzarov","year":"2013","journal-title":"Informatica"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1016\/j.ins.2007.03.028"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1016\/j.patcog.2011.01.017"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/ICEPT.2017.8046589"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2015.2492581"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.3390\/s151025882"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TPAMI.2010.143"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TIP.2002.806245"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TMECH.2013.2260555"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2012.07.018"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.ndteint.2016.11.003"},{"key":"ref17","doi-asserted-by":"crossref","first-page":"1086","DOI":"10.5302\/J.ICROS.2017.17.0187","article-title":"Defect classification method of PCB solder joint by color features and region segmentation","volume":"23","author":"hyoung","year":"2017","journal-title":"Journal of Institute Control Robotics and Systems"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2017.12.032"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2018.2873744"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2011.5995678"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2016.388"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2009.2023318"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TPHP.1977.1135225"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMECH.2014.2368789"},{"key":"ref29","doi-asserted-by":"crossref","first-page":"124","DOI":"10.1109\/TII.2015.2500098","article-title":"Bearing defect classification based on individual wavelet local fisher discriminant analysis with particle swarm optimization","volume":"12","author":"van","year":"2016","journal-title":"IEEE Trans Ind Informat"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2018.2880900"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2009.01.010"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2016.2643694"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TMECH.2015.2487507"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1002\/seup.200211103"},{"key":"ref1","author":"tummala","year":"2001","journal-title":"Microelectronics Packaging Handbook"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ICNSC.2007.372853"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2018.2815608"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/CSIP.2012.6309059"},{"key":"ref24","doi-asserted-by":"crossref","first-page":"1940","DOI":"10.1109\/TIP.2008.2002304","article-title":"Minimization of region-scalable fitting energy for image segmentation","volume":"17","author":"li","year":"2008","journal-title":"IEEE Trans Image Process"},{"key":"ref23","first-page":"271","article-title":"A multiphase level set framework for image segmentation using the mumford and shah model","author":"luminita","year":"2002","journal-title":"Proc 1st IEEE Workshop Variational Level Set Methods Comput Vis"},{"key":"ref26","doi-asserted-by":"crossref","first-page":"3243","DOI":"10.1109\/TIP.2010.2069690","article-title":"Distance regularized level set evolution and its application to image segmentation","volume":"19","author":"li","year":"2010","journal-title":"IEEE Trans Image Process"},{"key":"ref25","author":"osher","year":"2002","journal-title":"Level Set Methods and Dynamic Implicit Surfaces"}],"container-title":["IEEE Transactions on Industrial Informatics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9424\/9046115\/08892669.pdf?arnumber=8892669","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,9,22]],"date-time":"2023-09-22T15:27:24Z","timestamp":1695396444000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8892669\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,7]]},"references-count":34,"journal-issue":{"issue":"7"},"URL":"https:\/\/doi.org\/10.1109\/tii.2019.2950496","relation":{},"ISSN":["1551-3203","1941-0050"],"issn-type":[{"value":"1551-3203","type":"print"},{"value":"1941-0050","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020,7]]}}}