{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,9]],"date-time":"2026-06-09T13:22:56Z","timestamp":1781011376729,"version":"3.54.1"},"reference-count":40,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T00:00:00Z","timestamp":1648771200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T00:00:00Z","timestamp":1648771200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T00:00:00Z","timestamp":1648771200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Inf."],"published-print":{"date-parts":[[2022,4]]},"DOI":"10.1109\/tii.2021.3101492","type":"journal-article","created":{"date-parts":[[2021,8,4]],"date-time":"2021-08-04T20:31:26Z","timestamp":1628109086000},"page":"2364-2373","source":"Crossref","is-referenced-by-count":32,"title":["Defect Detection and Depth Estimation in CFRP Through Phase of Transient Response of Flash Thermography"],"prefix":"10.1109","volume":"18","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-7065-9092","authenticated-orcid":false,"given":"Bahadin","family":"Azizinasab","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6431-758X","authenticated-orcid":false,"given":"Reza P. R.","family":"Hasanzadeh","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1525-5324","authenticated-orcid":false,"given":"Saeid","family":"Hedayatrasa","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9325-0556","authenticated-orcid":false,"given":"Mathias","family":"Kersemans","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.3390\/ma14092436"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1016\/j.ndteint.2018.07.008"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1016\/j.compositesb.2019.107461"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1117\/12.596602"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.3166\/qirt.1.47-70"},{"key":"ref30","first-page":"399","article-title":"Thermal wave materials characterization and thermal wave imaging","author":"favro","year":"0","journal-title":"Senssor for Material Characterization Processing and Manufacuring"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1063\/1.4978010"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.3390\/app8020257"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2019.2936221"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1016\/j.ndteint.2018.12.010"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2018.2888519"},{"key":"ref40","author":"oppenheim","year":"1999","journal-title":"Discrete-Time Signal Processing"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.compositesb.2020.108305"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.ndteint.2020.102247"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1117\/1.1566969"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/S0263-8223(02)00161-7"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1063\/1.362662"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2017.2744179"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TIP.2020.3036770"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.infrared.2020.103288"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.infrared.2021.103754"},{"key":"ref28","article-title":"Quantitative subsurface defect evaluation by pulsed phase thermography: Depth retrieval with the phase","author":"ibarra-castanedo","year":"2005"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2018.2834462"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1007\/s10921-019-0607-4"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2018.2820816"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2011.2166797"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1016\/j.ndteint.2017.02.003"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2016.2596080"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.compositesa.2017.06.018"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.compositesb.2016.07.019"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2018.2881341"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2018.2870670"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2015.2479856"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/j.infrared.2012.08.006"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2018.2802046"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2014.2301168"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TIP.2017.2783627"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2018.2839614"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijthermalsci.2019.106196"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1016\/j.compstruct.2021.113846"}],"container-title":["IEEE Transactions on Industrial Informatics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9424\/9670747\/09506942.pdf?arnumber=9506942","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,4,8]],"date-time":"2022-04-08T17:59:19Z","timestamp":1649440759000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9506942\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,4]]},"references-count":40,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tii.2021.3101492","relation":{},"ISSN":["1551-3203","1941-0050"],"issn-type":[{"value":"1551-3203","type":"print"},{"value":"1941-0050","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,4]]}}}