{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,10]],"date-time":"2026-06-10T16:41:29Z","timestamp":1781109689178,"version":"3.54.1"},"reference-count":29,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2022,12,1]],"date-time":"2022-12-01T00:00:00Z","timestamp":1669852800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,12,1]],"date-time":"2022-12-01T00:00:00Z","timestamp":1669852800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,12,1]],"date-time":"2022-12-01T00:00:00Z","timestamp":1669852800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"National Key Research and Development Program of China","award":["2020YFB1711100"],"award-info":[{"award-number":["2020YFB1711100"]}]},{"name":"Ministry of Education-China Mobile Research Foundation Project of China","award":["MCM20180703"],"award-info":[{"award-number":["MCM20180703"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Inf."],"published-print":{"date-parts":[[2022,12]]},"DOI":"10.1109\/tii.2022.3162268","type":"journal-article","created":{"date-parts":[[2022,3,25]],"date-time":"2022-03-25T19:51:16Z","timestamp":1648237876000},"page":"9008-9016","source":"Crossref","is-referenced-by-count":40,"title":["Data-Driven Adaptive Virtual Metrology for Yield Prediction in Multibatch Wafers"],"prefix":"10.1109","volume":"18","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-4220-5154","authenticated-orcid":false,"given":"Hong-Wei","family":"Xu","sequence":"first","affiliation":[{"name":"Department of Industrial Engineering and Management, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8527-0354","authenticated-orcid":false,"given":"Wei","family":"Qin","sequence":"additional","affiliation":[{"name":"Department of Industrial Engineering and Management, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7201-8603","authenticated-orcid":false,"given":"You-Long","family":"Lv","sequence":"additional","affiliation":[{"name":"Institute of Artificial Intelligence, Donghua University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6215-0237","authenticated-orcid":false,"given":"Jie","family":"Zhang","sequence":"additional","affiliation":[{"name":"Institute of Artificial Intelligence, Donghua University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.jprocont.2017.12.004"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ASMC.2009.5155973"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/HICSS.2013.163"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.conengprac.2019.104262"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2019.2932377"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.4172\/2153-0602.C1.003"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCST.2018.2876140"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2016.2520906"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2007.907607"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2014.2374339"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1007\/s10845-005-0008-7"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2017.2754641"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1142\/S0218194019400126"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1080\/00207540600596874"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.measurement.2019.04.070"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/tii.2021.3130411"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1080\/00207540050205073"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/CCA.2014.6981569"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2009.05.053"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2016.2574130"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2010.08.040"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.3390\/pr9020305"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2020.3036676"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2019.2952931"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2015.1109153"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TSMCB.2002.1033180"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2018.2880968"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/IIKI.2014.14"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.3390\/app10010386"}],"container-title":["IEEE Transactions on Industrial Informatics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9424\/9906876\/09743325.pdf?arnumber=9743325","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,11,4]],"date-time":"2022-11-04T01:10:03Z","timestamp":1667524203000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9743325\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,12]]},"references-count":29,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tii.2022.3162268","relation":{},"ISSN":["1551-3203","1941-0050"],"issn-type":[{"value":"1551-3203","type":"print"},{"value":"1941-0050","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,12]]}}}