{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,8]],"date-time":"2026-10-08T17:18:48Z","timestamp":1791479928054,"version":"4.3.4"},"reference-count":33,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2023,2,1]],"date-time":"2023-02-01T00:00:00Z","timestamp":1675209600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,2,1]],"date-time":"2023-02-01T00:00:00Z","timestamp":1675209600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,2,1]],"date-time":"2023-02-01T00:00:00Z","timestamp":1675209600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Sichuan Science and Technology Department","award":["2021YFH0119"],"award-info":[{"award-number":["2021YFH0119"]}]},{"DOI":"10.13039\/501100004912","name":"Sichuan University","doi-asserted-by":"publisher","award":["2020SCUNG205"],"award-info":[{"award-number":["2020SCUNG205"]}],"id":[{"id":"10.13039\/501100004912","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Inf."],"published-print":{"date-parts":[[2023,2]]},"DOI":"10.1109\/tii.2022.3190350","type":"journal-article","created":{"date-parts":[[2022,7,20]],"date-time":"2022-07-20T15:36:23Z","timestamp":1658331383000},"page":"2183-2191","source":"Crossref","is-referenced-by-count":30,"title":["Progressive Interaction-Learning Network for Lightweight Single-Image Super-Resolution in Industrial Applications"],"prefix":"10.1109","volume":"19","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-4928-3542","authenticated-orcid":false,"given":"Jiayi","family":"Qin","sequence":"first","affiliation":[{"name":"College of Electronics and Information Engineering, Sichuan University, Chengdu, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0948-1600","authenticated-orcid":false,"given":"Lihui","family":"Chen","sequence":"additional","affiliation":[{"name":"College of Electronics and Information Engineering, Sichuan University, Chengdu, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Seunggil","family":"Jeon","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Suwon, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1094-3841","authenticated-orcid":false,"given":"Xiaomin","family":"Yang","sequence":"additional","affiliation":[{"name":"College of Electronics and Information Engineering, Sichuan University, Chengdu, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1609\/aaai.v34i07.6877"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1016\/j.cviu.2021.103254"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TIP.2018.2877483"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/ICCV.2017.486"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2018.00082"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/3343031.3351084"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCYB.2020.2970104"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2016.182"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2016.181"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2017.243"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TPAMI.2015.2389824"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-10593-2_13"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2018.00262"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-01234-2_18"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TPAMI.2015.2439281"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TITS.2017.2762406"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ICCV.2019.00069"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1002\/cpe.4188"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.3791\/50048"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2017.618"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TGRS.2021.3131228"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-01249-6_16"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2019.2953106"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JIOT.2017.2787779"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2017.298"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ICSC.2016.50"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2019.00399"},{"key":"ref22","article-title":"Deep captioning with multimodal recurrent neural networks (m-RNN","author":"mao","year":"0","journal-title":"Proc Presented at the Int Conf Learn Representations"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.3115\/v1\/D14-1179"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2019.01132"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-58542-6_17"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-67070-2_3"},{"key":"ref25","first-page":"7354","article-title":"Self-attention generative adversarial networks","author":"zhang","year":"0","journal-title":"Proc 36th Int Conf Mach Learn"}],"container-title":["IEEE Transactions on Industrial Informatics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9424\/9989328\/09834144.pdf?arnumber=9834144","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,1,16]],"date-time":"2023-01-16T14:15:12Z","timestamp":1673878512000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9834144\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,2]]},"references-count":33,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tii.2022.3190350","relation":{},"ISSN":["1551-3203","1941-0050"],"issn-type":[{"value":"1551-3203","type":"print"},{"value":"1941-0050","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,2]]}}}