{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,8]],"date-time":"2026-08-08T18:02:22Z","timestamp":1786212142955,"version":"3.56.0"},"reference-count":24,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["72271044"],"award-info":[{"award-number":["72271044"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62276054"],"award-info":[{"award-number":["62276054"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Sichuan Science and Technology Program","award":["2023YFG0156"],"award-info":[{"award-number":["2023YFG0156"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Inf."],"published-print":{"date-parts":[[2024,3]]},"DOI":"10.1109\/tii.2023.3301065","type":"journal-article","created":{"date-parts":[[2023,8,15]],"date-time":"2023-08-15T17:49:21Z","timestamp":1692121761000},"page":"3133-3143","source":"Crossref","is-referenced-by-count":6,"title":["Weakly Supervised End-to-End Learning for Inspection on Multidirectional Integrated Circuit Markings in Surface Mount Technology"],"prefix":"10.1109","volume":"20","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-4577-0952","authenticated-orcid":false,"given":"Zhongshu","family":"Chen","sequence":"first","affiliation":[{"name":"School of Mechanical and Electrical Engineering, University of Electronic Science and Technology of China, Chengdu, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1598-1249","authenticated-orcid":false,"given":"Lin","family":"Zuo","sequence":"additional","affiliation":[{"name":"School of Information and Software Engineering, University of Electronic Science and Technology of China, Chengdu, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0002-6095-5645","authenticated-orcid":false,"given":"Feng","family":"Guo","sequence":"additional","affiliation":[{"name":"School of Computer Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-4820-4428","authenticated-orcid":false,"given":"Changhua","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Mechanical and Electrical Engineering, University of Electronic Science and Technology of China, Chengdu, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4367-5097","authenticated-orcid":false,"given":"Yu","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Mechanical and Electrical Engineering, Center for System Reliability and Safety, University of Electronic Science and Technology of China, Chengdu, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2018.2875920"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2017.2705078"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2013.06.004"},{"issue":"103732","key":"ref4","article-title":"Industrial character recognition based on improved CRNN in complex environments","volume":"42","author":"Zhang","year":"2022","journal-title":"Comput. Ind."},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2002.804906"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-006-0669-1"},{"issue":"5","key":"ref7","first-page":"361","article-title":"An automated IC chip marking inspection system for surface mounted devices on taping machines","volume":"68","author":"Chen","year":"2009","journal-title":"J. Sci. Ind. Res."},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1117\/12.2228808"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/IHMSC.2016.106"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.23919\/ChiCC.2018.8483850"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1117\/12.2573005"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.23919\/CCC50068.2020.9189395"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1007\/s11263-020-01369-0"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2018.00595"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-58621-8_41"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR52688.2022.00455"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2016.254"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2019.2945403"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2020.3013277"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-58526-6_30"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TPAMI.2007.1078"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2021.3093388"},{"issue":"11","key":"ref23","first-page":"2579","article-title":"Visualizing data using t-SNE","volume":"9","author":"Maaten","year":"2008","journal-title":"J. Mach. Learn. Res."},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1145\/1143844.1143891"}],"container-title":["IEEE Transactions on Industrial Informatics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9424\/10460266\/10219142.pdf?arnumber=10219142","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,8]],"date-time":"2024-03-08T19:08:47Z","timestamp":1709924927000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10219142\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,3]]},"references-count":24,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/tii.2023.3301065","relation":{},"ISSN":["1551-3203","1941-0050"],"issn-type":[{"value":"1551-3203","type":"print"},{"value":"1941-0050","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,3]]}}}