{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,7]],"date-time":"2026-05-07T07:05:20Z","timestamp":1778137520658,"version":"3.51.4"},"reference-count":20,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"European Union Next-GenerationEU"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Inf."],"published-print":{"date-parts":[[2025,4]]},"DOI":"10.1109\/tii.2024.3523559","type":"journal-article","created":{"date-parts":[[2025,1,14]],"date-time":"2025-01-14T20:26:05Z","timestamp":1736886365000},"page":"3177-3185","source":"Crossref","is-referenced-by-count":2,"title":["Digital Twin Modeling of Hand Assembled Random Wire Harnesses"],"prefix":"10.1109","volume":"21","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-5614-1601","authenticated-orcid":false,"given":"Xiaokang","family":"Liu","sequence":"first","affiliation":[{"name":"College of Electrical Engineering, Sichuan University, Chengdu, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0564-6690","authenticated-orcid":false,"given":"Xinglong","family":"Wu","sequence":"additional","affiliation":[{"name":"Department of Electronics, Information and Bioengineering, Politecnico di Milano, Milan, Italy"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6844-8766","authenticated-orcid":false,"given":"Flavia","family":"Grassi","sequence":"additional","affiliation":[{"name":"Department of Electronics, Information and Bioengineering, Politecnico di Milano, Milan, Italy"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9778-693X","authenticated-orcid":false,"given":"Giordano","family":"Spadacini","sequence":"additional","affiliation":[{"name":"Department of Electronics, Information and Bioengineering, Politecnico di Milano, Milan, Italy"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6657-1530","authenticated-orcid":false,"given":"Sergio A.","family":"Pignari","sequence":"additional","affiliation":[{"name":"Department of Electronics, Information and Bioengineering, Politecnico di Milano, Milan, Italy"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2021.3066421"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2014.2307198"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1002\/9781119082880.ch2"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2007.897142"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2015.2414356"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MEMC.0.8093845"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.23919\/EMC.1999.10791609"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2000.875562"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2019.2922455"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3113767"},{"issue":"5","key":"ref11","first-page":"53002","article-title":"Modeling and statistical analysis of distribution parameters of random cable bundles based on image recognition technology","volume":"33","author":"Fan","year":"2021","journal-title":"High Power Laser Part. Beams (in Chinese)"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2018.2873186"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/IETC54973.2022.9796840"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/itherm51669.2021.9503206"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.3390\/robotics11060120"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1002\/9780470290996"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.1975.303430"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/9780470547212"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/INMMIC.2018.8430023"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/MMM.2008.919919"}],"container-title":["IEEE Transactions on Industrial Informatics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/9424\/10949153\/10841816.pdf?arnumber=10841816","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,4,7]],"date-time":"2025-04-07T22:24:55Z","timestamp":1744064695000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10841816\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,4]]},"references-count":20,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tii.2024.3523559","relation":{},"ISSN":["1551-3203","1941-0050"],"issn-type":[{"value":"1551-3203","type":"print"},{"value":"1941-0050","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,4]]}}}