{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,25]],"date-time":"2026-03-25T16:08:21Z","timestamp":1774454901039,"version":"3.50.1"},"reference-count":30,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"11","license":[{"start":{"date-parts":[[2025,11,1]],"date-time":"2025-11-01T00:00:00Z","timestamp":1761955200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,11,1]],"date-time":"2025-11-01T00:00:00Z","timestamp":1761955200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,11,1]],"date-time":"2025-11-01T00:00:00Z","timestamp":1761955200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["12272012"],"award-info":[{"award-number":["12272012"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100004750","name":"Aeronautical Science Foundation of China","doi-asserted-by":"publisher","award":["2022Z057075001"],"award-info":[{"award-number":["2022Z057075001"]}],"id":[{"id":"10.13039\/501100004750","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Inf."],"published-print":{"date-parts":[[2025,11]]},"DOI":"10.1109\/tii.2025.3584556","type":"journal-article","created":{"date-parts":[[2025,7,18]],"date-time":"2025-07-18T17:48:39Z","timestamp":1752860919000},"page":"8619-8629","source":"Crossref","is-referenced-by-count":1,"title":["A Machine Learning Framework for Rapidly Identifying and Predicting Mechanical Properties of Interconnected Layer in SiC Module Considering Surface Metallization Effect Under High-Temperature Aging"],"prefix":"10.1109","volume":"21","author":[{"given":"Libo","family":"Zhao","sequence":"first","affiliation":[{"name":"Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2636-772X","authenticated-orcid":false,"given":"Yanwei","family":"Dai","sequence":"additional","affiliation":[{"name":"Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6369-8272","authenticated-orcid":false,"given":"Fei","family":"Qin","sequence":"additional","affiliation":[{"name":"Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2021.3070326"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2019.2901543"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.matdes.2022.111389"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2020.3032962"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmrt.2022.12.015"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1007\/s40194-019-00736-x"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2018.10.067"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.msea.2021.141729"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2021.3132197"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1186\/s40563-018-0115-2"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1111\/ffe.12920"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1111\/ffe.13425"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2023.3254644"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2019.2945583"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.actamat.2022.118420"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.engstruct.2022.115156"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1007\/s10338-022-00340-5"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.engfracmech.2021.107643"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.engfracmech.2023.109651"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/j.conbuildmat.2023.130870"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/S0013-7944(97)00059-3"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2856205"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TMI.2019.2939044"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TNNLS.2016.2582924"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijepes.2021.107563"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1007\/s00354-020-00104-0"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1016\/j.matpr.2021.10.083"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2020.2986501"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1007\/s10854-017-8087-8"},{"issue":"1","key":"ref30","first-page":"120","article-title":"Confusion matrix-based feature selection","volume":"710","author":"Visa","year":"2011","journal-title":"Maics"}],"container-title":["IEEE Transactions on Industrial Informatics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/9424\/11206732\/11085061.pdf?arnumber=11085061","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,18]],"date-time":"2025-10-18T05:01:26Z","timestamp":1760763686000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11085061\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,11]]},"references-count":30,"journal-issue":{"issue":"11"},"URL":"https:\/\/doi.org\/10.1109\/tii.2025.3584556","relation":{},"ISSN":["1551-3203","1941-0050"],"issn-type":[{"value":"1551-3203","type":"print"},{"value":"1941-0050","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,11]]}}}