{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2023,9,6]],"date-time":"2023-09-06T11:04:36Z","timestamp":1693998276270},"reference-count":21,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2012,12,1]],"date-time":"2012-12-01T00:00:00Z","timestamp":1354320000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Instrum. Meas."],"published-print":{"date-parts":[[2012,12]]},"DOI":"10.1109\/tim.2012.2211471","type":"journal-article","created":{"date-parts":[[2012,8,30]],"date-time":"2012-08-30T18:02:55Z","timestamp":1346349775000},"page":"3198-3206","source":"Crossref","is-referenced-by-count":12,"title":["Electrical Performance of the Recessed Probe Launch Technique for Measurement of Embedded Multilayer Structures"],"prefix":"10.1109","volume":"61","author":[{"given":"Miroslav","family":"Kotzev","sequence":"first","affiliation":[]},{"given":"Renato","family":"Rimolo-Donadio","sequence":"additional","affiliation":[]},{"given":"Young H.","family":"Kwark","sequence":"additional","affiliation":[]},{"given":"Christian W.","family":"Baks","sequence":"additional","affiliation":[]},{"given":"Xiaoxiong","family":"Gu","sequence":"additional","affiliation":[]},{"given":"Christian","family":"Schuster","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.1979.1129778"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.6028\/jres.097.024"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.1983.1131433"},{"key":"ref13","year":"2011","journal-title":"High Frequency Structure Simulator (HFSS)"},{"key":"ref14","year":"2011","journal-title":"Picoprobe"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2001.966968"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/22.817486"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2005.864127"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.1979.1123990"},{"key":"ref19","first-page":"434","author":"gupta","year":"1996","journal-title":"Microstrip Lines and Slotlines"},{"key":"ref4","article-title":"Eliminating unwanted test fixture effects in multi-gigabit device measurements: Coupled line S-parameter deembedding and thru-reflect-line (TRL) calibration technique","author":"tehan","year":"2005","journal-title":"Proc IEC Designcon Conf"},{"key":"ref3","first-page":"1","article-title":"Practical design and implementation of stripline TRL calibration fixtures for 10-gigabit interconnect analysis","author":"duperron","year":"2006","journal-title":"Proc IEC Designcon Conf"},{"key":"ref6","first-page":"248","article-title":"Effect of via stubs on the TRL calibration technique for measurement of embedded multilayer structures","author":"kotzev","year":"2010","journal-title":"Proc EuMC"},{"key":"ref5","article-title":"The recessed probe launch—A new signal launch for high frequency characterization of board level packaging","author":"kwark","year":"2005","journal-title":"Proc IEC Designcon Conf"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/GEMIC.2009.4815847"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2008.4484891"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2003.811678"},{"key":"ref1","first-page":"1","article-title":"Method for optimizing a 10 Gb\/s PCB signal launch","author":"vogel","year":"2004","journal-title":"Proc IEC Designcon Conf"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/SPI.2009.5089854"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/22.3659"},{"key":"ref21","year":"1989","journal-title":"Wideband stripline to microtrip transition"}],"container-title":["IEEE Transactions on Instrumentation and Measurement"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/19\/6342839\/06291781.pdf?arnumber=6291781","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,10,10]],"date-time":"2021-10-10T23:51:48Z","timestamp":1633909908000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6291781\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,12]]},"references-count":21,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tim.2012.2211471","relation":{},"ISSN":["0018-9456","1557-9662"],"issn-type":[{"value":"0018-9456","type":"print"},{"value":"1557-9662","type":"electronic"}],"subject":[],"published":{"date-parts":[[2012,12]]}}}