{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T10:09:35Z","timestamp":1740132575053,"version":"3.37.3"},"reference-count":35,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2018,1,1]],"date-time":"2018-01-01T00:00:00Z","timestamp":1514764800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"name":"Technical Quality Education Program, Phase-II, SVNIT, Surat","award":["ECED\/TEQIP-II\/1910\/2015-2016"],"award-info":[{"award-number":["ECED\/TEQIP-II\/1910\/2015-2016"]}]},{"name":"Ministry of Human Resource Department under Ph.D. Fellowship Scheme"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Instrum. Meas."],"published-print":{"date-parts":[[2018,1]]},"DOI":"10.1109\/tim.2017.2754864","type":"journal-article","created":{"date-parts":[[2017,10,9]],"date-time":"2017-10-09T18:08:27Z","timestamp":1507572507000},"page":"107-115","source":"Crossref","is-referenced-by-count":7,"title":["Characterization of High-Frequency Dielectric Laminates Using a Scanning-Probe Based on EBG Structure"],"prefix":"10.1109","volume":"67","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-9530-5242","authenticated-orcid":false,"given":"Rahul","family":"Yadav","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Piyush N.","family":"Patel","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"crossref","first-page":"524","DOI":"10.1109\/LMWC.2017.2690873","article-title":"Design of SRR-based microwave sensor for characterization of magnetodielectric substrates","volume":"27","author":"shafi","year":"2017","journal-title":"IEEE Microw Wireless Compon Lett"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1016\/j.jestch.2016.11.010"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1002\/mmce.21055"},{"journal-title":"TMM 13i Laminates Rogers Corporation","year":"2017","key":"ref30"},{"journal-title":"RO4835 Laminates","year":"2017","key":"ref35"},{"journal-title":"Nelco N4000-13","year":"2017","key":"ref34"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2008.2003520"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2012.2199193"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2013.2270050"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/22.75310"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2006.884390"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1002\/mop.29979"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2012.2203450"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2013.2285918"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2016.2591320"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2012.2201739"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1002\/mop.10825"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2015.2418199"},{"journal-title":"Computer simulation technology","year":"2016","key":"ref27"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.bios.2014.05.025"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MIM.2007.364985"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.1977.1129179"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2013.2243751"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2013.2272120"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2013.2246905"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2016.2542287"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/LAWP.2016.2535115"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSTQE.2016.2629665"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2007.895413"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2007.905601"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2011.2156408"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2016.2527499"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2006.884506"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/j.aeue.2016.03.012"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/22.798001"}],"container-title":["IEEE Transactions on Instrumentation and Measurement"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/19\/8169260\/08062823.pdf?arnumber=8062823","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:24:37Z","timestamp":1642004677000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8062823\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,1]]},"references-count":35,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/tim.2017.2754864","relation":{},"ISSN":["0018-9456","1557-9662"],"issn-type":[{"type":"print","value":"0018-9456"},{"type":"electronic","value":"1557-9662"}],"subject":[],"published":{"date-parts":[[2018,1]]}}}