{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,18]],"date-time":"2026-01-18T13:33:00Z","timestamp":1768743180133,"version":"3.49.0"},"reference-count":41,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Development of Weapons and Technological Infrastructure Agency"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Instrum. Meas."],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/tim.2018.2879144","type":"journal-article","created":{"date-parts":[[2018,11,22]],"date-time":"2018-11-22T19:27:17Z","timestamp":1542914837000},"page":"3766-3775","source":"Crossref","is-referenced-by-count":5,"title":["Comparative Study on Modeling Approaches of V-Shaped MEMS Temperature Sensors"],"prefix":"10.1109","volume":"68","author":[{"given":"Yaniv","family":"Cohen","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5836-0549","authenticated-orcid":false,"given":"Assaf","family":"Ya'akobovitz","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1088\/0964-1726\/16\/5\/029"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2014.08.004"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1063\/1.333965"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2009.04.027"},{"key":"ref31","first-page":"130","volume":"7","author":"young","year":"2002","journal-title":"Formulas for Stress and Strain"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/SENSOR.2007.4300125"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2004.839347"},{"key":"ref36","doi-asserted-by":"crossref","first-page":"1511","DOI":"10.1109\/JSEN.2008.923582","article-title":"A monolithic CMOS-MEMS 3-axis accelerometer with a low-noise, low-power dual-chopper amplifier","volume":"8","author":"qu","year":"2008","journal-title":"IEEE Sensors J"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.69.045403"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1063\/1.325408"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1117\/12.443016"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2008.2007274"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmps.2004.02.003"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.5370\/JEET.2006.1.2.263"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2012.2227948"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2009.2038026"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2012.2199189"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1007\/s00542-013-1990-x"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/CCECE.2015.7129090"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2010.05.014"},{"key":"ref19","doi-asserted-by":"crossref","first-page":"33","DOI":"10.47566\/2018_syv31_1-020033","article-title":"Thermoelectrical characterization and comparative analysis of three finite element models of a MEMS thermal sensor","volume":"31","author":"franco","year":"2018","journal-title":"Superficies Vacío"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-4247(02)00202-9"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.852041"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2000.866818"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1364\/OL.33.002455"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICSENS.2009.5398204"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2012.2185820"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.858476"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2010.2101310"},{"key":"ref7","first-page":"181","article-title":"Linear thermomechanical microactuators","author":"cragun","year":"1999","journal-title":"Proc ASME IMECE"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1063\/1.2344835"},{"key":"ref9","first-page":"154","article-title":"A bistable microrelay based on two-segment multimorph cantilever actuators","author":"sun","year":"1998","journal-title":"Proc 11th Annu Int Workshop Micro Electro Mech Syst"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1115\/1.3149515"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/84.485216"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/14\/7\/002"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2005.845449"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/13\/2\/321"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/25\/12\/125030"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/9\/1\/308"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/84.925771"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/26\/2\/025010"}],"container-title":["IEEE Transactions on Instrumentation and Measurement"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/19\/8836348\/08543508.pdf?arnumber=8543508","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,13]],"date-time":"2022-07-13T21:08:12Z","timestamp":1657746492000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8543508\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":41,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/tim.2018.2879144","relation":{},"ISSN":["0018-9456","1557-9662"],"issn-type":[{"value":"0018-9456","type":"print"},{"value":"1557-9662","type":"electronic"}],"subject":[],"published":{"date-parts":[[2019,10]]}}}