{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,29]],"date-time":"2026-05-29T21:00:58Z","timestamp":1780088458262,"version":"3.54.0"},"reference-count":35,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2021,1,1]],"date-time":"2021-01-01T00:00:00Z","timestamp":1609459200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,1,1]],"date-time":"2021-01-01T00:00:00Z","timestamp":1609459200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,1,1]],"date-time":"2021-01-01T00:00:00Z","timestamp":1609459200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100014438","name":"Business Finland Funded Project","doi-asserted-by":"publisher","award":["Dnro 3944\/31\/2014"],"award-info":[{"award-number":["Dnro 3944\/31\/2014"]}],"id":[{"id":"10.13039\/501100014438","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002341","name":"Academy of Finland\u2019s FIRI Funding","doi-asserted-by":"publisher","award":["320017"],"award-info":[{"award-number":["320017"]}],"id":[{"id":"10.13039\/501100002341","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100008530","name":"European Regional Development Fund\u2019s Novel Digitally Fabricated Materials for Electronics, Optics and Medical Applications","doi-asserted-by":"publisher","award":["A74080"],"award-info":[{"award-number":["A74080"]}],"id":[{"id":"10.13039\/501100008530","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Instrum. Meas."],"published-print":{"date-parts":[[2021]]},"DOI":"10.1109\/tim.2020.3043112","type":"journal-article","created":{"date-parts":[[2020,12,8]],"date-time":"2020-12-08T23:57:43Z","timestamp":1607471863000},"page":"1-10","source":"Crossref","is-referenced-by-count":5,"title":["Hybrid Thermal Modeling to Predict LED Thermal Behavior in Hybrid Electronics"],"prefix":"10.1109","volume":"70","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-0840-0565","authenticated-orcid":false,"given":"Esa","family":"Hannila","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3452-4836","authenticated-orcid":false,"given":"Noora","family":"Heinilehto","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4371-7939","authenticated-orcid":false,"given":"Kari","family":"Remes","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6463-9941","authenticated-orcid":false,"given":"Janne","family":"Lauri","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6539-0666","authenticated-orcid":false,"given":"Kimmo","family":"Keranen","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4729-8740","authenticated-orcid":false,"given":"Tapio","family":"Fabritius","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2018.2809078"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1364\/OL.44.002574"},{"key":"ref31","article-title":"IR-imaging based system for detecting the defects of conductive materials","volume":"9205","author":"lepp\u00e4nen","year":"2014","journal-title":"Proc SPIE"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1016\/j.jcrysgro.2005.12.049"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1364\/OE.26.001219"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1364\/OE.21.032358"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.engfracmech.2017.10.020"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JEDS.2019.2903868"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1145\/2766962"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201703817"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1088\/1757-899X\/409\/1\/012032"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijthermalsci.2009.07.010"},{"key":"ref16","year":"2016","journal-title":"WP15 Evaluating the Lifetime Behavior of LED Systems White Paper 20161201"},{"key":"ref17","first-page":"1","article-title":"Multi-physics simulation and reliability analysis for LED luminaires under step stress accelerated degradation test","author":"tang","year":"2012","journal-title":"Proc 13th Int Thermal Mech Multi-Phys Simulation Exp Microelectron Microsyst"},{"key":"ref18","first-page":"1","article-title":"Thermal management in flexible substrates for LEDs","author":"tapaninen","year":"2014","journal-title":"Proc IMAPS Nordic Conf"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2012.11.009"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/I2MTC43012.2020.9128941"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2014.2311810"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.3390\/en13123130"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2019.2962576"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/I2MTC.2019.8827057"},{"key":"ref29","year":"2016","journal-title":"WP23 How to Measure Thermal Resistance of LED Emitters and LED Arrays White Paper 20161201"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1108\/13552541211212113"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.compositesb.2010.10.009"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2019.2923858"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.201603763"},{"key":"ref9","first-page":"18","article-title":"History and manufacturing of glass","volume":"7","author":"berenjian","year":"2017","journal-title":"Am J Mater Sci"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2018.8351806"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2012.2206390"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2013.06.036"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/j.phpro.2011.11.024"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2015.11.034"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2013.11.058"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2017.03.039"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2019.2936924"}],"container-title":["IEEE Transactions on Instrumentation and Measurement"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/19\/9259274\/09286559.pdf?arnumber=9286559","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T14:51:16Z","timestamp":1652194276000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9286559\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021]]},"references-count":35,"URL":"https:\/\/doi.org\/10.1109\/tim.2020.3043112","relation":{},"ISSN":["0018-9456","1557-9662"],"issn-type":[{"value":"0018-9456","type":"print"},{"value":"1557-9662","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021]]}}}