{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,2]],"date-time":"2026-04-02T15:28:55Z","timestamp":1775143735303,"version":"3.50.1"},"reference-count":42,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2021,1,1]],"date-time":"2021-01-01T00:00:00Z","timestamp":1609459200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,1,1]],"date-time":"2021-01-01T00:00:00Z","timestamp":1609459200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,1,1]],"date-time":"2021-01-01T00:00:00Z","timestamp":1609459200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["U2066215"],"award-info":[{"award-number":["U2066215"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Young Elite Scientists Sponsorship Program by CSEE","award":["2018025"],"award-info":[{"award-number":["2018025"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Instrum. Meas."],"published-print":{"date-parts":[[2021]]},"DOI":"10.1109\/tim.2021.3106108","type":"journal-article","created":{"date-parts":[[2021,8,19]],"date-time":"2021-08-19T19:43:17Z","timestamp":1629402197000},"page":"1-12","source":"Crossref","is-referenced-by-count":14,"title":["Inversion Algorithm for Surface Charge Distribution on Insulator in Shift-Invariant System Based on Constrained Least Square Filter"],"prefix":"10.1109","volume":"70","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-0517-1357","authenticated-orcid":false,"given":"Zijun","family":"Pan","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6397-1192","authenticated-orcid":false,"given":"Ju","family":"Tang","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3523-8452","authenticated-orcid":false,"given":"Boli","family":"Hu","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4735-5047","authenticated-orcid":false,"given":"Cheng","family":"Pan","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6147-7345","authenticated-orcid":false,"given":"Yi","family":"Luo","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1730-3564","authenticated-orcid":false,"given":"Shiyi","family":"Mao","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6463\/ab90b1"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/TC.1973.5009169"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2004.1387815"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2017.2730981"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2003.1194112"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/94.625365"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2017.006067"},{"key":"ref36","author":"gonzales","year":"2002","journal-title":"Digital Image Processing"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2004.1266325"},{"key":"ref34","author":"tikhonov","year":"1977","journal-title":"VYArsenin Solutions of Ill-Posed Problems"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1063\/1.5110976"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6463\/abb38f"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2019.2937408"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1063\/1.1662414"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/57.917527"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TPWRD.2007.899289"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.30.1262"},{"key":"ref16","doi-asserted-by":"crossref","first-page":"612","DOI":"10.1109\/TDEI.2013.6508765","article-title":"Dynamic behavior of surface charge distribution during partial discharge sequences","volume":"20","author":"wu","year":"2013","journal-title":"IEEE Trans Dielectrics Electr Insul"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6463\/aa5605"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2020.008960"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2019.8726048"},{"key":"ref28","first-page":"10","article-title":"Development of studies about surface charge accumulation on insulating material under HVDC","volume":"32","author":"tang","year":"2017","journal-title":"Trans China Electrotech Soc"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2021.009574"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1063\/1.1748947"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.17775\/CSEEJPES.2019.00820"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2015.2454651"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/61.4242"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2018.007555"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6463\/aa5207"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2019.2938905"},{"key":"ref2","first-page":"4649","article-title":"Review of charge accumulation characteristics at gas-solid interface in DC GIL, part I: Measurement and mechanisms","volume":"33","author":"zhang","year":"2018","journal-title":"Trans China Electrotech Soc"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6463\/ab6d1a"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TDC.2016.7519973"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1088\/0950-7671\/44\/7\/308"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2004.1349790"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2004.1387814"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2019.008021"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/94.708264"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2019.8726031"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2011.6032850"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1049\/hve.2019.0289"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2017.006496"}],"container-title":["IEEE Transactions on Instrumentation and Measurement"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/19\/9259274\/09517283.pdf?arnumber=9517283","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T14:51:22Z","timestamp":1652194282000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9517283\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021]]},"references-count":42,"URL":"https:\/\/doi.org\/10.1109\/tim.2021.3106108","relation":{},"ISSN":["0018-9456","1557-9662"],"issn-type":[{"value":"0018-9456","type":"print"},{"value":"1557-9662","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021]]}}}