{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,18]],"date-time":"2025-11-18T09:29:32Z","timestamp":1763458172301,"version":"3.37.3"},"reference-count":32,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2022,1,1]],"date-time":"2022-01-01T00:00:00Z","timestamp":1640995200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,1,1]],"date-time":"2022-01-01T00:00:00Z","timestamp":1640995200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,1,1]],"date-time":"2022-01-01T00:00:00Z","timestamp":1640995200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["U2133213","52071332"],"award-info":[{"award-number":["U2133213","52071332"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100021171","name":"Basic and Applied Basic Research Foundation of Guangdong Province","doi-asserted-by":"publisher","award":["2022A1515010691","2020A1515110218"],"award-info":[{"award-number":["2022A1515010691","2020A1515110218"]}],"id":[{"id":"10.13039\/501100021171","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100007162","name":"Department of Science and Technology of Guangdong Province","doi-asserted-by":"publisher","award":["2019QN01H430","2019TQ05Z654"],"award-info":[{"award-number":["2019QN01H430","2019TQ05Z654"]}],"id":[{"id":"10.13039\/501100007162","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100010877","name":"Science and Technology Innovation Commission of Shenzhen","doi-asserted-by":"publisher","award":["ZDSYS20190902093209795","JCYJ20180507182239617","JCYJ20210324101200002"],"award-info":[{"award-number":["ZDSYS20190902093209795","JCYJ20180507182239617","JCYJ20210324101200002"]}],"id":[{"id":"10.13039\/501100010877","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Instrum. Meas."],"published-print":{"date-parts":[[2022]]},"DOI":"10.1109\/tim.2022.3210962","type":"journal-article","created":{"date-parts":[[2022,9,30]],"date-time":"2022-09-30T19:42:59Z","timestamp":1664566979000},"page":"1-10","source":"Crossref","is-referenced-by-count":3,"title":["In-Situ Ultrasonic Inspection of Thickness and Morphology of Thermal Interface Material in Multilayer Structure Using Modified Minimum Entropy Deconvolution"],"prefix":"10.1109","volume":"71","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-9638-4309","authenticated-orcid":false,"given":"Shifeng","family":"Guo","sequence":"first","affiliation":[{"name":"Shenzhen Key Laboratory of Smart Sensing and Intelligent Systems and Guangdong Provincial Key Laboratory of Robotics and Intelligent System, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5802-1539","authenticated-orcid":false,"given":"Yangyang","family":"Huang","sequence":"additional","affiliation":[{"name":"Shenzhen Key Laboratory of Smart Sensing and Intelligent Systems and Guangdong Provincial Key Laboratory of Robotics and Intelligent System, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7740-6960","authenticated-orcid":false,"given":"Dan","family":"Chen","sequence":"additional","affiliation":[{"name":"Shenzhen Key Laboratory of Smart Sensing and Intelligent Systems and Guangdong Provincial Key Laboratory of Robotics and Intelligent System, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8692-3663","authenticated-orcid":false,"given":"Linlin","family":"Ren","sequence":"additional","affiliation":[{"name":"Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6957-2494","authenticated-orcid":false,"given":"Dawei","family":"Wang","sequence":"additional","affiliation":[{"name":"Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9845-999X","authenticated-orcid":false,"given":"Wei","family":"Feng","sequence":"additional","affiliation":[{"name":"Guangdong Provincial Key Laboratory of Robotics and Intelligent System, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China"}]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.1080\/09506608.2017.1301014"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1038\/s41586-020-2666-1"},{"issue":"7589","key":"ref3","doi-asserted-by":"crossref","first-page":"144","DOI":"10.1038\/530144a","article-title":"The semiconductor industry will soon abandon its pursuit of moore\u2019s law. now things could get a lot more interesting","volume":"530","author":"Waldrop","year":"2016","journal-title":"Nature"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1007\/978-3-319-31596-6_1"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1021\/nl203906r"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.1002\/adfm.201900412"},{"doi-asserted-by":"publisher","key":"ref7","DOI":"10.1016\/j.cej.2019.122550"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1021\/acsaelm.9b00312"},{"doi-asserted-by":"publisher","key":"ref9","DOI":"10.1109\/TIM.2019.2950824"},{"doi-asserted-by":"publisher","key":"ref10","DOI":"10.1002\/adma.201705544"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.1016\/j.polymer.2012.09.049"},{"doi-asserted-by":"publisher","key":"ref12","DOI":"10.1016\/j.diamond.2020.107976"},{"doi-asserted-by":"publisher","key":"ref13","DOI":"10.1016\/j.ijheatmasstransfer.2016.01.061"},{"doi-asserted-by":"publisher","key":"ref14","DOI":"10.1109\/ITHERM.2014.6892289"},{"doi-asserted-by":"publisher","key":"ref15","DOI":"10.1016\/S0026-2692(02)00191-X"},{"doi-asserted-by":"publisher","key":"ref16","DOI":"10.1109\/ITHERM.2000.866807"},{"doi-asserted-by":"publisher","key":"ref17","DOI":"10.1109\/ECTC.2015.7159585"},{"doi-asserted-by":"publisher","key":"ref18","DOI":"10.1109\/TIM.2020.3033377"},{"doi-asserted-by":"publisher","key":"ref19","DOI":"10.1109\/TIM.2020.2966315"},{"doi-asserted-by":"publisher","key":"ref20","DOI":"10.1109\/TII.2019.2955493"},{"doi-asserted-by":"publisher","key":"ref21","DOI":"10.3390\/s18071981"},{"doi-asserted-by":"publisher","key":"ref22","DOI":"10.1109\/TCAPT.2002.1010010"},{"doi-asserted-by":"publisher","key":"ref23","DOI":"10.3390\/app10238516"},{"doi-asserted-by":"publisher","key":"ref24","DOI":"10.1016\/j.ndteint.2007.05.002"},{"doi-asserted-by":"publisher","key":"ref25","DOI":"10.1016\/j.ultras.2011.10.001"},{"doi-asserted-by":"publisher","key":"ref26","DOI":"10.1016\/0016-7142(78)90005-4"},{"doi-asserted-by":"publisher","key":"ref27","DOI":"10.1109\/78.575716"},{"doi-asserted-by":"publisher","key":"ref28","DOI":"10.1016\/j.ymssp.2021.108018"},{"doi-asserted-by":"publisher","key":"ref29","DOI":"10.1016\/j.ymssp.2016.05.036"},{"doi-asserted-by":"publisher","key":"ref30","DOI":"10.1016\/j.ndteint.2019.02.005"},{"doi-asserted-by":"publisher","key":"ref31","DOI":"10.1016\/j.ndteint.2011.12.005"},{"key":"ref32","first-page":"2825","article-title":"Scikit-learn: Machine learning in Python","volume":"12","author":"Pedregosa","year":"2011","journal-title":"J. Mach. Learn. Res."}],"container-title":["IEEE Transactions on Instrumentation and Measurement"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/19\/9717300\/09906135.pdf?arnumber=9906135","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,22]],"date-time":"2024-01-22T21:51:14Z","timestamp":1705960274000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9906135\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022]]},"references-count":32,"URL":"https:\/\/doi.org\/10.1109\/tim.2022.3210962","relation":{},"ISSN":["0018-9456","1557-9662"],"issn-type":[{"type":"print","value":"0018-9456"},{"type":"electronic","value":"1557-9662"}],"subject":[],"published":{"date-parts":[[2022]]}}}