{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,28]],"date-time":"2025-06-28T06:24:26Z","timestamp":1751091866252,"version":"3.40.2"},"reference-count":21,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62264003"],"award-info":[{"award-number":["62264003"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100004607","name":"Guangxi Natural Science Foundation Program","doi-asserted-by":"publisher","award":["2023GXNSFAA026188"],"award-info":[{"award-number":["2023GXNSFAA026188"]}],"id":[{"id":"10.13039\/501100004607","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Innovation-Driven Development Project of Guangxi Province","award":["GuiKeAA21077015"],"award-info":[{"award-number":["GuiKeAA21077015"]}]},{"name":"Guilin Science Research and Technology Development Program","award":["20220107-2"],"award-info":[{"award-number":["20220107-2"]}]},{"name":"Innovation Project of GUET Graduate Education","award":["2022YCXS022","2021YCXB01"],"award-info":[{"award-number":["2022YCXS022","2021YCXB01"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Instrum. Meas."],"published-print":{"date-parts":[[2024]]},"DOI":"10.1109\/tim.2023.3338663","type":"journal-article","created":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T18:20:56Z","timestamp":1701454856000},"page":"1-8","source":"Crossref","is-referenced-by-count":2,"title":["Highly Stable Pin Pull Test Method for PCB Pad Cratering Characterization"],"prefix":"10.1109","volume":"73","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-9262-4088","authenticated-orcid":false,"given":"Hengjian","family":"He","sequence":"first","affiliation":[{"name":"Guangxi Education Department Key Laboratory of Microelectronic Packaging and Assembly Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5836-0998","authenticated-orcid":false,"given":"Miao","family":"Cai","sequence":"additional","affiliation":[{"name":"Guangxi Education Department Key Laboratory of Microelectronic Packaging and Assembly Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6310-7946","authenticated-orcid":false,"given":"Minghui","family":"Yun","sequence":"additional","affiliation":[{"name":"Guangxi Education Department Key Laboratory of Microelectronic Packaging and Assembly Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-3188-3308","authenticated-orcid":false,"given":"Hao","family":"Chen","sequence":"additional","affiliation":[{"name":"Guangxi Education Department Key Laboratory of Microelectronic Packaging and Assembly Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-2185-4881","authenticated-orcid":false,"given":"Huanhuan","family":"Wang","sequence":"additional","affiliation":[{"name":"Guangxi Education Department Key Laboratory of Microelectronic Packaging and Assembly Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2735-2076","authenticated-orcid":false,"given":"Daoguo","family":"Yang","sequence":"additional","affiliation":[{"name":"Guangxi Education Department Key Laboratory of Microelectronic Packaging and Assembly Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"issue":"1","key":"ref1","first-page":"7","article-title":"Requirements of base material of PCB for 5G communication","volume":"29","author":"Lin","year":"2021","journal-title":"Printed Circuit Inf."},{"issue":"1","key":"ref2","first-page":"21","article-title":"Comprehensive methodology to characterize and mitigate BGA pad cratering in printed circuit boards","volume":"22","author":"Ahmad","year":"2009","journal-title":"J. SMTA"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2013.07.025"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2011.2134670"},{"key":"ref5","first-page":"1","article-title":"Validated test method to characterize and quantify pad cratering under BGA pads on printed circuit boards","volume-title":"Proc. APEX Expo.","author":"Ahmad"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2003.10.009"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1115\/1.4046555"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2022.3154814"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2022.3153997"},{"issue":"4","key":"ref10","first-page":"271","article-title":"Pad cratering: Reliability of assembly level and joint level","volume":"10","author":"Obaidat","year":"2016","journal-title":"Jordan J. Mech. Ind. Eng."},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2019.2911073"},{"key":"ref12","first-page":"16","article-title":"The study of pad cratering impacted by different type of PCB materials","volume":"z1","author":"Ye","year":"2014","journal-title":"Printed Circuit Inf."},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1115\/1.4004182"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2011.5898672"},{"volume-title":"Test Methods for Characterization of PCB Pad Cratering","year":"2011","key":"ref15"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ICEPT.2015.7236794"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2013.6575818"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1115\/1.4053309"},{"volume-title":"Rework of Electronic Assemblies","year":"2017","key":"ref19"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ICEPT52650.2021.9568138"},{"key":"ref21","first-page":"139","article-title":"Research on printed circuit board pad cratering test methods","volume-title":"Proc. China Electron. Manuf. Packag. Technol. Annu. Conf.","author":"Song"}],"container-title":["IEEE Transactions on Instrumentation and Measurement"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/19\/10367905\/10339348.pdf?arnumber=10339348","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,22]],"date-time":"2025-03-22T00:33:00Z","timestamp":1742603580000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10339348\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024]]},"references-count":21,"URL":"https:\/\/doi.org\/10.1109\/tim.2023.3338663","relation":{},"ISSN":["0018-9456","1557-9662"],"issn-type":[{"type":"print","value":"0018-9456"},{"type":"electronic","value":"1557-9662"}],"subject":[],"published":{"date-parts":[[2024]]}}}