{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,3,25]],"date-time":"2025-03-25T04:10:56Z","timestamp":1742875856123,"version":"3.40.2"},"reference-count":31,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2022YFB3203900"],"award-info":[{"award-number":["2022YFB3203900"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52105594"],"award-info":[{"award-number":["52105594"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Fundamental Research Program of Shanxi Province","award":["20210302124274"],"award-info":[{"award-number":["20210302124274"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Instrum. Meas."],"published-print":{"date-parts":[[2024]]},"DOI":"10.1109\/tim.2024.3420362","type":"journal-article","created":{"date-parts":[[2024,7,8]],"date-time":"2024-07-08T17:29:21Z","timestamp":1720459761000},"page":"1-8","source":"Crossref","is-referenced-by-count":0,"title":["Preparation and Performance Evaluation of a Miniature High-Temperature Heat Flux Sensor With Centralized Thermal Insulation Structure"],"prefix":"10.1109","volume":"73","author":[{"ORCID":"https:\/\/orcid.org\/0009-0002-3287-6341","authenticated-orcid":false,"given":"Xiaofen","family":"Li","sequence":"first","affiliation":[{"name":"Science and Technology on Electronic Test and Measurement Laboratory and the State Key Laboratory of Dynamic Measurement Technology, North University of China, Taiyuan, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0005-5253-1916","authenticated-orcid":false,"given":"Lei","family":"Zhang","sequence":"additional","affiliation":[{"name":"Science and Technology on Electronic Test and Measurement Laboratory and the State Key Laboratory of Dynamic Measurement Technology, North University of China, Taiyuan, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8481-9448","authenticated-orcid":false,"given":"Hao","family":"Xie","sequence":"additional","affiliation":[{"name":"Science and Technology on Electronic Test and Measurement Laboratory and the State Key Laboratory of Dynamic Measurement Technology, North University of China, Taiyuan, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0006-5596-399X","authenticated-orcid":false,"given":"Ze","family":"Shang","sequence":"additional","affiliation":[{"name":"Science and Technology on Electronic Test and Measurement Laboratory and the State Key Laboratory of Dynamic Measurement Technology, North University of China, Taiyuan, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-6507-3938","authenticated-orcid":false,"given":"Xiangxiang","family":"Zhang","sequence":"additional","affiliation":[{"name":"Science and Technology on Electronic Test and Measurement Laboratory and the State Key Laboratory of Dynamic Measurement Technology, North University of China, Taiyuan, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6936-2603","authenticated-orcid":false,"given":"Xue","family":"Qi","sequence":"additional","affiliation":[{"name":"Science and Technology on Electronic Test and Measurement Laboratory and the State Key Laboratory of Dynamic Measurement Technology, North University of China, Taiyuan, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0004-4618-7226","authenticated-orcid":false,"given":"Meimei","family":"Lu","sequence":"additional","affiliation":[{"name":"Science and Technology on Electronic Test and Measurement Laboratory and the State Key Laboratory of Dynamic Measurement Technology, North University of China, Taiyuan, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7877-9278","authenticated-orcid":false,"given":"Qiulin","family":"Tan","sequence":"additional","affiliation":[{"name":"Science and Technology on Electronic Test and Measurement Laboratory and the State Key Laboratory of Dynamic Measurement Technology, North University of China, Taiyuan, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2022.123559"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.3390\/s19122805"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.engfailanal.2012.05.028"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/0017-9310(91)90293-n"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1111\/j.1551-2916.2010.03889.x"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1088\/1742-6596\/2131\/4\/042009"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.2514\/1.A35251"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.measurement.2018.10.076"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2016.02.043"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1002\/fam.992"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.matlet.2022.133336"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.2514\/1.32011"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1115\/1.3211866"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.2514\/2.3288"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2019.2948645"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2021.112587"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ICIASF.2001.960251"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.2514\/1.42298"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1115\/GT2011-46853"},{"article-title":"Development of high-density arrays of thin film heat transfer gauges","volume-title":"Proc. 5th ASME\/JSME Therm Eng. Joint Conf.","author":"Anthony","key":"ref20"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/j.mee.2019.111128"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2020.2993592"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2023.3306986"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2021.117860"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1063\/1.4973967"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/j.csite.2023.103121"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1115\/1.2906555"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/S1452-3981(23)06520-3"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.3390\/mi14010004"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.3390\/cryst7040096"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1039\/c3cp55059a"}],"container-title":["IEEE Transactions on Instrumentation and Measurement"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/19\/10367905\/10589485.pdf?arnumber=10589485","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,24]],"date-time":"2025-03-24T18:05:37Z","timestamp":1742839537000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10589485\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024]]},"references-count":31,"URL":"https:\/\/doi.org\/10.1109\/tim.2024.3420362","relation":{},"ISSN":["0018-9456","1557-9662"],"issn-type":[{"type":"print","value":"0018-9456"},{"type":"electronic","value":"1557-9662"}],"subject":[],"published":{"date-parts":[[2024]]}}}