{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,18]],"date-time":"2025-12-18T14:27:38Z","timestamp":1766068058493,"version":"3.37.3"},"reference-count":31,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Instrum. Meas."],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/tim.2024.3497173","type":"journal-article","created":{"date-parts":[[2024,11,13]],"date-time":"2024-11-13T18:51:59Z","timestamp":1731523919000},"page":"1-8","source":"Crossref","is-referenced-by-count":4,"title":["System-Efficient ESD Design Based on a Modular Measurement System Applied to USB"],"prefix":"10.1109","volume":"74","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-1347-1541","authenticated-orcid":false,"given":"Lucas","family":"Speckbacher","sequence":"first","affiliation":[{"name":"Institute of Electronics, Graz University of Technology, Graz, Austria"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0649-8159","authenticated-orcid":false,"given":"David Johannes","family":"Pommerenke","sequence":"additional","affiliation":[{"name":"Institute of Electronics and SAL-GEMC Laboratory, Graz University of Technology, Graz, Austria"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6061-4280","authenticated-orcid":false,"given":"Gabriel","family":"Fellner","sequence":"additional","affiliation":[{"name":"Institute of Electronics, Graz University of Technology, Graz, Austria"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-3403-3867","authenticated-orcid":false,"given":"Lukas","family":"Pertoll","sequence":"additional","affiliation":[{"name":"Institute of Electronics, Graz University of Technology, Graz, Austria"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6280-3613","authenticated-orcid":false,"given":"Harald","family":"Gossner","sequence":"additional","affiliation":[{"name":"Intel Deutschland, Neubiberg, Germany"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/spi54345.2022.9874937"},{"volume-title":"White Paper\u2014ESD and Latch-Up challenges\u2014An Outlook Until 2030","year":"2023","key":"ref2"},{"volume-title":"White Paper 2 Part II: Die-to-Die Interfaces\u2014A Case for Lowering Component-Level CDM ESD Specifications and Requirements Revision 1.0","year":"2023","key":"ref3"},{"volume-title":"White Paper 3 System Level ESD Part III: Review of IEC 61000-4-2 ESD Testing and Impact on System-Efficient ESD Design (SEED)","year":"2023","key":"ref4"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2018.2888691"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/tdmr.2012.2231414"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/irps.2013.6531947"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2016.2581839"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2021.3071644"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.23919\/EOS\/ESD.2018.8509765"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2010.2058790"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2022.3214438"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2018.2811645"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2013.2239017"},{"key":"ref15","first-page":"1","article-title":"ESD system level characterization and modeling methods applied to a LIN transceiver","volume-title":"Proc. EOS\/ESD Symp.","author":"Besse"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2015.2406664"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2018.2890704"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.23919\/EOSESD.2017.8073428"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/19.982985"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/19.918155"},{"volume-title":"Dmesg(8)\u2014Linux Man Page","year":"2023","key":"ref21"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2009.2017657"},{"volume-title":"White Paper 1: A Case for Lowering Component Level HBM ESD Specifications and Requirements","year":"2023","key":"ref23"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2020.3011544"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1007\/s00502-023-01199-1"},{"volume-title":"LibreVNA","year":"2023","key":"ref26"},{"volume-title":"LiteVNA 64","year":"2023","key":"ref27"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/EMCEurope57790.2023.10274253"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2022.3221312"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.23919\/EOS\/ESD.2018.8509780"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/EOSESD.2016.7592566"}],"container-title":["IEEE Transactions on Instrumentation and Measurement"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/19\/10764799\/10752553.pdf?arnumber=10752553","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,11,27]],"date-time":"2024-11-27T09:12:44Z","timestamp":1732698764000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10752553\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":31,"URL":"https:\/\/doi.org\/10.1109\/tim.2024.3497173","relation":{},"ISSN":["0018-9456","1557-9662"],"issn-type":[{"type":"print","value":"0018-9456"},{"type":"electronic","value":"1557-9662"}],"subject":[],"published":{"date-parts":[[2025]]}}}