{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,3]],"date-time":"2026-06-03T19:02:28Z","timestamp":1780513348197,"version":"3.54.1"},"reference-count":26,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Korea government","award":["NRF-2021R1A2C2014652"],"award-info":[{"award-number":["NRF-2021R1A2C2014652"]}]},{"DOI":"10.13039\/501100014189","name":"Korea Institute of Planning and Evaluation for Technology in Food, Agriculture and Forestry","doi-asserted-by":"crossref","id":[{"id":"10.13039\/501100014189","id-type":"DOI","asserted-by":"crossref"}]},{"name":"Open Field Smart Agriculture Technology Short-term Advancement Program"},{"DOI":"10.13039\/501100003624","name":"Ministry of Agriculture, Food and Rural Affairs","doi-asserted-by":"publisher","award":["322029032HD070"],"award-info":[{"award-number":["322029032HD070"]}],"id":[{"id":"10.13039\/501100003624","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003836","name":"IC Design Education Center (IDEC) for the Chip Fabrication, South Korea","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003836","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Instrum. Meas."],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/tim.2024.3502763","type":"journal-article","created":{"date-parts":[[2024,11,20]],"date-time":"2024-11-20T19:00:08Z","timestamp":1732129208000},"page":"1-8","source":"Crossref","is-referenced-by-count":2,"title":["A BJT\/Resistor Hybrid CMOS Temperature Sensor With Low 3<i>\u03c3<\/i>-Inaccuracy at 0-pt Trim"],"prefix":"10.1109","volume":"74","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-8747-0624","authenticated-orcid":false,"given":"Jiseong","family":"Lee","sequence":"first","affiliation":[{"name":"School of Electrical Engineering, Korea University, Seoul, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9410-9028","authenticated-orcid":false,"given":"Seung Soo","family":"Kwak","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Korea University, Seoul, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9187-9169","authenticated-orcid":false,"given":"Yun Chan","family":"Im","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Korea University, Seoul, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0002-1201-0305","authenticated-orcid":false,"given":"Hyunjin","family":"Lee","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Korea University, Seoul, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6177-1496","authenticated-orcid":false,"given":"Yong Sin","family":"Kim","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Korea University, Seoul, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2019.2928575"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.2017.7931023"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2013.2273572"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3291621"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2015.2408804"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2688334"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3316013"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2016.2614273"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2011.2178433"},{"key":"ref10","author":"Makinwa","year":"2024","journal-title":"Smart Temperature Sensor Survey"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2024.3366572"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/a-sscc47793.2019.9056962"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310312"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830436"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2020.3010501"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2788878"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/19.799639"},{"key":"ref18","article-title":"Non-linearity of resistance\/temperature characteristic: Its influence on performance of precision resistors","author":"Zandman","year":"2013"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067457"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/0250-6874(86)80037-3"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2020.2999272"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2916418"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2020.2992839"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3208770"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2023.3276016"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454423"}],"container-title":["IEEE Transactions on Instrumentation and Measurement"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/19\/10764799\/10758705.pdf?arnumber=10758705","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,12,7]],"date-time":"2024-12-07T05:41:28Z","timestamp":1733550088000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10758705\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":26,"URL":"https:\/\/doi.org\/10.1109\/tim.2024.3502763","relation":{},"ISSN":["0018-9456","1557-9662"],"issn-type":[{"value":"0018-9456","type":"print"},{"value":"1557-9662","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025]]}}}