{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,5]],"date-time":"2026-03-05T02:21:01Z","timestamp":1772677261205,"version":"3.50.1"},"reference-count":22,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"IIT Palakkad, Sensors and Electronic Instrumentation Laboratory (SEIL) Exploratory Research Grant (ERG) Project","award":["2024-232-EESRVERG-SP"],"award-info":[{"award-number":["2024-232-EESRVERG-SP"]}]},{"name":"IIT Palakkad Technology IHub Foundation (IPTIF) for financial assistance received through technology development","award":["IPTIF\/TD\/IP\/003"],"award-info":[{"award-number":["IPTIF\/TD\/IP\/003"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Instrum. Meas."],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/tim.2025.3550217","type":"journal-article","created":{"date-parts":[[2025,3,11]],"date-time":"2025-03-11T17:35:18Z","timestamp":1741714518000},"page":"1-12","source":"Crossref","is-referenced-by-count":5,"title":["An Inductive Sensor System for Linear and Angular Displacement Measurement With Negligible Cross-Sensitivity"],"prefix":"10.1109","volume":"74","author":[{"ORCID":"https:\/\/orcid.org\/0009-0006-2133-129X","authenticated-orcid":false,"given":"Srikar","family":"Emany","sequence":"first","affiliation":[{"name":"Department of Electrical Engineering, Indian Institute of Technology Palakkad, Palakkad, India"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2668-1863","authenticated-orcid":false,"given":"A. S.","family":"Anil Kumar","sequence":"additional","affiliation":[{"name":"Department of Measurement, Faculty of Electrical Engineering, Czech Technical University at Prague, Prague, Czech Republic"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7550-2641","authenticated-orcid":false,"given":"Satyajit","family":"Das","sequence":"additional","affiliation":[{"name":"Department of Data Science, Indian Institute of Technology Palakkad, Palakkad, India"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2289-0924","authenticated-orcid":false,"given":"Sreenath","family":"Vijayakumar","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Indian Institute of Technology Palakkad, Palakkad, India"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/7361.983469"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2020.3045461"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1201\/9781003040019"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2023.3344469"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/s0026-0576(02)80427-5"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICACTM.2019.8776712"},{"key":"ref7","volume-title":"Fabrication method and structure of PCB assembly, and tool for assembly thereof","author":"Pan","year":"2007"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2007.913597"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/19.328885"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2017.2761958"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2019.2908508"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2023.3298916"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2024.3425159"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TMECH.2014.2301824"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2677308"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2019.2929538"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/I2MTC60896.2024.10560779"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2014.2303257"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1063\/1.4919907"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2022.3172430"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/19.199446"},{"issue":"2","key":"ref22","doi-asserted-by":"crossref","first-page":"269","DOI":"10.1016\/j.sna.2007.03.027","article-title":"Integrated micro-displacement sensor that measures tilting angle and linear movement of an external mirror","volume":"138","author":"Ishikawa","year":"2007","journal-title":"Sens. Actuators A, Phys."}],"container-title":["IEEE Transactions on Instrumentation and Measurement"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/19\/10764799\/10922777.pdf?arnumber=10922777","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,27]],"date-time":"2025-03-27T02:31:41Z","timestamp":1743042701000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10922777\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":22,"URL":"https:\/\/doi.org\/10.1109\/tim.2025.3550217","relation":{},"ISSN":["0018-9456","1557-9662"],"issn-type":[{"value":"0018-9456","type":"print"},{"value":"1557-9662","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025]]}}}