{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,17]],"date-time":"2025-05-17T04:12:31Z","timestamp":1747455151287,"version":"3.40.5"},"reference-count":30,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61971180"],"award-info":[{"award-number":["61971180"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100010009","name":"Heilongjiang Provincial Key Laboratory of Micro-Nano Sensitive Devices and Systems","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100010009","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Instrum. Meas."],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/tim.2025.3566830","type":"journal-article","created":{"date-parts":[[2025,5,5]],"date-time":"2025-05-05T17:55:09Z","timestamp":1746467709000},"page":"1-10","source":"Crossref","is-referenced-by-count":0,"title":["A Test Response Systolic Compression Method Based on Compressed Sensing"],"prefix":"10.1109","volume":"74","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-1927-0839","authenticated-orcid":false,"given":"Yuheng","family":"Lin","sequence":"first","affiliation":[{"name":"Electronic Engineering College, Heilongjiang University, Harbin, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2245-0278","authenticated-orcid":false,"given":"Jing","family":"Hu","sequence":"additional","affiliation":[{"name":"Electronic Engineering College, Heilongjiang University, Harbin, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2006.876523"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-007-5043-1"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/mdt.2008.39"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/tcad.2011.2159116"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2010.45"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2012.6271757"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICSICT.2012.6467671"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1049\/iet-cdt.2011.0104"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/AUTEST.2017.8080504"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.micpro.2018.05.001"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/tc.2007.70833"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/tcad.2008.2006093"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-018-5717-x"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/tcad.2015.2459035"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/tc.2018.2801847"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.22581\/muet1982.2002.11"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/tvlsi.2021.3092421"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/tim.2020.3042319"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ITC50671.2022.00008"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/tcad.2023.3261781"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/tim.2023.3271742"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2023.3344696"},{"volume-title":"Design Compiler User Guide","year":"2020","key":"ref23"},{"volume-title":"TestMAX DFT User Guide","year":"2020","key":"ref24"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/tcad.2012.2214479"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI-DAT.2014.6834865"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/CADGraphics.2013.20"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/j.micpro.2020.103169"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.2966452"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2017.7918357"}],"container-title":["IEEE Transactions on Instrumentation and Measurement"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/19\/10764799\/10984430.pdf?arnumber=10984430","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,5,16]],"date-time":"2025-05-16T17:43:40Z","timestamp":1747417420000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10984430\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":30,"URL":"https:\/\/doi.org\/10.1109\/tim.2025.3566830","relation":{},"ISSN":["0018-9456","1557-9662"],"issn-type":[{"type":"print","value":"0018-9456"},{"type":"electronic","value":"1557-9662"}],"subject":[],"published":{"date-parts":[[2025]]}}}