{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,20]],"date-time":"2026-06-20T22:34:01Z","timestamp":1781994841004,"version":"3.54.5"},"reference-count":37,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62401451"],"award-info":[{"award-number":["62401451"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62131017"],"award-info":[{"award-number":["62131017"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Postdoctoral Fellowship Program of China Postdoctoral Science Foundation","award":["GZB20230584"],"award-info":[{"award-number":["GZB20230584"]}]},{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Foundation","doi-asserted-by":"publisher","award":["2024M762579"],"award-info":[{"award-number":["2024M762579"]}],"id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]},{"name":"National Key Research and Development Program of China","award":["2022YFB3205700"],"award-info":[{"award-number":["2022YFB3205700"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Instrum. Meas."],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/tim.2025.3573350","type":"journal-article","created":{"date-parts":[[2025,5,26]],"date-time":"2025-05-26T17:55:48Z","timestamp":1748282148000},"page":"1-10","source":"Crossref","is-referenced-by-count":3,"title":["High-Sensitivity 4H-Silicon Carbide MEMS Pressure Sensors for Extreme Temperature Ranges of \u221275 \u00b0C to 600 \u00b0C"],"prefix":"10.1109","volume":"74","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-5363-0140","authenticated-orcid":false,"given":"Lukang","family":"Wang","sequence":"first","affiliation":[{"name":"Department of Hepatobiliary Surgery, The First Affiliated Hospital of Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5365-4890","authenticated-orcid":false,"given":"Yu","family":"Yang","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-1807-9008","authenticated-orcid":false,"given":"Yabing","family":"Wang","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-0583-1413","authenticated-orcid":false,"given":"Jinglan","family":"Huo","sequence":"additional","affiliation":[{"name":"School of Optoelectronic Engineering, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0004-3079-1082","authenticated-orcid":false,"given":"Nuo","family":"Wan","sequence":"additional","affiliation":[{"name":"Institute of Xi’an Aerospace Solid Propulsion Technology, Academy of Aerospace Propulsion Technology, China Aerospace Science and Technology Corporation, Xi’an, Shaanxi, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8305-5984","authenticated-orcid":false,"given":"You","family":"Zhao","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3636-6664","authenticated-orcid":false,"given":"Yi","family":"Lyu","sequence":"additional","affiliation":[{"name":"Department of Hepatobiliary Surgery, National Local Joint Engineering Research Center for Precision Surgery and Regenerative Medicine, The First Affiliated Hospital of Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2922-1037","authenticated-orcid":false,"given":"Yulong","family":"Zhao","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6310-948X","authenticated-orcid":false,"given":"Ming","family":"Liu","sequence":"additional","affiliation":[{"name":"State Key Laboratory for Manufacturing Systems Engineering, Electronic Materials Research Laboratory, Key Laboratory of the Ministry of Education and International Center for Dielectric Research, School of Electronic Science and Engineering, Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2020.2971288"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2023.3342244"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2798562"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2022.113864"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2018.07.006"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2009.2026996"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6439\/ab8909"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2003.07.011"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.3390\/mi14051045"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1063\/5.0194794"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2023.3268334"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1126\/sciadv.adg2080"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2023.3271202"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2024.3373813"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.ceramint.2022.01.100"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2023.3329367"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2022.3148702"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/SENSORS47087.2021.9639506"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2018.02.027"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/j.matdes.2022.111297"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2024.115388"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2020.3019711"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2015.2470132"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6439\/aa7c68"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1038\/s41598-020-77083-1"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1038\/micronano.2016.48"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TRANSDUCERS.2019.8808340"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1117\/12.723406"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/ICSENS.2010.5690714"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.2514\/6.2001-4652"},{"key":"ref31","first-page":"7","article-title":"SiC backside via-hole process for GaN HEMT MMICs using high etch rate ICP etching","volume-title":"Proc. CS MANTECH Conf. Dig.","author":"Okamoto"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.2017.7863497"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1016\/j.ceramint.2020.10.220"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2021.3121882"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1016\/j.matdes.2018.07.014"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1038\/s41378-023-00496-1"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1063\/1.5037545"}],"container-title":["IEEE Transactions on Instrumentation and Measurement"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/19\/10764799\/11015576.pdf?arnumber=11015576","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,6]],"date-time":"2025-06-06T17:41:45Z","timestamp":1749231705000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11015576\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":37,"URL":"https:\/\/doi.org\/10.1109\/tim.2025.3573350","relation":{},"ISSN":["0018-9456","1557-9662"],"issn-type":[{"value":"0018-9456","type":"print"},{"value":"1557-9662","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025]]}}}