{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,30]],"date-time":"2026-04-30T05:39:00Z","timestamp":1777527540933,"version":"3.51.4"},"reference-count":56,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2018,10,1]],"date-time":"2018-10-01T00:00:00Z","timestamp":1538352000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2018,10,1]],"date-time":"2018-10-01T00:00:00Z","timestamp":1538352000000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2018,10,1]],"date-time":"2018-10-01T00:00:00Z","timestamp":1538352000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2018,10,1]],"date-time":"2018-10-01T00:00:00Z","timestamp":1538352000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"SRC"},{"name":"NSF","award":["CCF-1252500"],"award-info":[{"award-number":["CCF-1252500"]}]},{"DOI":"10.13039\/100000181","name":"AFOSR","doi-asserted-by":"crossref","award":["FA9550-13-1-0110"],"award-info":[{"award-number":["FA9550-13-1-0110"]}],"id":[{"id":"10.13039\/100000181","id-type":"DOI","asserted-by":"crossref"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Multi-Scale Comp. Syst."],"published-print":{"date-parts":[[2018,10,1]]},"DOI":"10.1109\/tmscs.2018.2846274","type":"journal-article","created":{"date-parts":[[2018,6,12]],"date-time":"2018-06-12T19:38:18Z","timestamp":1528832298000},"page":"758-772","source":"Crossref","is-referenced-by-count":33,"title":["LIBRA: Thermal and Process Variation Aware Reliability Management in Photonic Networks-on-Chip"],"prefix":"10.1109","volume":"4","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-0918-1755","authenticated-orcid":false,"given":"Sai Vineel Reddy","family":"Chittamuru","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7289-1530","authenticated-orcid":false,"given":"Ishan G.","family":"Thakkar","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0846-0066","authenticated-orcid":false,"given":"Sudeep","family":"Pasricha","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2012.6146487"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2007.4378787"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/1669112.1669152"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2018.2833876"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2010.5416626"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/2742060.2742067"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/3130218.3130226"},{"key":"ref8","first-page":"345","article-title":"OPAL: A multi-layer hybrid photonic NoC for 3D ICs","author":"Bahirat","year":"2011","journal-title":"Proc. 16th Asia South Pacific Des. Autom. Conf."},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1038\/nature16454"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/VLSID.2016.12"},{"key":"ref11","article-title":"Wafer-scale fabrication technology for silicon photonic integrated circuits","author":"Selvaraja","year":"2011"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2009.60"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/1146909.1147052"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2089072"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2321574"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.7873\/DATE2014.320"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2016.2600238"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/1391469.1391658"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/NoCS.2013.6558413"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2008.2000726"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1145\/1283780.1283827"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1145\/1250662.1250686"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2016.7479176"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1145\/2968456.2968468"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/mwscas.2015.7282035"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2749967"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2012.6176543"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/slip.2017.7974906"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.023"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2015.0454"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1364\/OE.18.003487"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1145\/3060517"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1364\/CLEO.2010.CThJ3"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2011.6055363"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1145\/2934583.2934592"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2278383"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2012.6237013"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1145\/1840845.1840853"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2015.7372609"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1515\/nanoph-2013-0013"},{"key":"ref41","article-title":"Theory and design of high-index-contrast microphotonic circuits","author":"Popovic","year":"2008"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1002\/lpor.201100017"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1364\/OE.23.009369"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1145\/2063384.2063454"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.1995.524546"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1145\/1454115.1454128"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1145\/1669112.1669172"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2079450"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2010.5653749"},{"key":"ref51","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2007.913186"},{"key":"ref52","first-page":"155","article-title":"Support vector regression machines","author":"Harris","year":"1996","journal-title":"Proc. 9th Int. Conf. Neural Inf. Process. Syst."},{"key":"ref53","doi-asserted-by":"publisher","DOI":"10.1145\/2602155"},{"key":"ref55","doi-asserted-by":"publisher","DOI":"10.1145\/2897937.2898063"},{"key":"ref57","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2017.7858340"},{"key":"ref58","doi-asserted-by":"publisher","DOI":"10.1364\/OE.18.019055"},{"key":"ref59","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2013.2294564"}],"container-title":["IEEE Transactions on Multi-Scale Computing Systems"],"original-title":[],"link":[{"URL":"https:\/\/ieeexplore.ieee.org\/ielaam\/6687315\/8630102\/8382285-aam.pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6687315\/8630102\/08382285.pdf?arnumber=8382285","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,24]],"date-time":"2024-01-24T00:42:30Z","timestamp":1706056950000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8382285\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,10,1]]},"references-count":56,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tmscs.2018.2846274","relation":{},"ISSN":["2332-7766","2372-207X"],"issn-type":[{"value":"2332-7766","type":"electronic"},{"value":"2372-207X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2018,10,1]]}}}