{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,18]],"date-time":"2025-12-18T18:42:36Z","timestamp":1766083356921,"version":"3.48.0"},"reference-count":29,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2025,12,1]],"date-time":"2025-12-01T00:00:00Z","timestamp":1764547200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,12,1]],"date-time":"2025-12-01T00:00:00Z","timestamp":1764547200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,12,1]],"date-time":"2025-12-01T00:00:00Z","timestamp":1764547200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["12302107"],"award-info":[{"award-number":["12302107"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["12102192"],"award-info":[{"award-number":["12102192"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Rel."],"published-print":{"date-parts":[[2025,12]]},"DOI":"10.1109\/tr.2025.3580345","type":"journal-article","created":{"date-parts":[[2025,7,9]],"date-time":"2025-07-09T23:18:29Z","timestamp":1752103109000},"page":"4604-4613","source":"Crossref","is-referenced-by-count":0,"title":["Application of Embedded Stress Sensors for Third-Generation Reliability of Electronic Systems: Validation and Calibration of Mechanical Models in Fan-Out Wafer-Level Packaging"],"prefix":"10.1109","volume":"74","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-2388-3294","authenticated-orcid":false,"given":"Yuexing","family":"Wang","sequence":"first","affiliation":[{"name":"China Academy of Engineering Physics, Institute of Electronic Engineering, Mianyang, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-5957-5403","authenticated-orcid":false,"given":"Linwei","family":"Cao","sequence":"additional","affiliation":[{"name":"China Academy of Engineering Physics, Institute of Electronic Engineering, Mianyang, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1958-4574","authenticated-orcid":false,"given":"Xu","family":"He","sequence":"additional","affiliation":[{"name":"School of Physics, Nanjing University of Science and Technology, Nanjing, China"}]},{"given":"Kun","family":"Liu","sequence":"additional","affiliation":[{"name":"China Academy of Engineering Physics, Institute of Electronic Engineering, Mianyang, China"}]},{"given":"Shuairong","family":"Deng","sequence":"additional","affiliation":[{"name":"China Academy of Engineering Physics, Institute of Electronic Engineering, Mianyang, China"}]},{"given":"Quanfeng","family":"Zhou","sequence":"additional","affiliation":[{"name":"China Academy of Engineering Physics, Institute of Electronic Engineering, Mianyang, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0326-5840","authenticated-orcid":false,"given":"Xiangyu","family":"Sun","sequence":"additional","affiliation":[{"name":"China Academy of Engineering Physics, Institute of Electronic Engineering, Mianyang, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0879-4269","authenticated-orcid":false,"given":"Yao","family":"Yao","sequence":"additional","affiliation":[{"name":"School of Civil Engineering, Xi’an University of Architecture and Technology, Xi’an, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/tcpmt.2015.2511626"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/tcpmt.2022.3144461"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2010.09.031"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-023-10845-5"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-024-48532-6"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmps.2024.105623"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/0749-6419(85)90004-X"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1520\/STP23915S"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-009-0858-4"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1108\/MI-09-2022-0173"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijmecsci.2024.109500"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmrt.2023.11.113"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2016.03.015"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2007.03.007"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.measurement.2017.06.029"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2001.923584"},{"issue":"4","key":"ref17","article-title":"A critical review of MEMS capacitive pressure sensors","volume":"187","author":"Balavalad","year":"2015","journal-title":"Sensors Transducers"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2885686"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.3390\/electronics13163255"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1115\/1.1452244"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ectc51529.2024.00035"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490655"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.4071\/1551-4897-7.1.35"},{"key":"ref24","first-page":"1","article-title":"Application of the IForce piezoresistive silicon based stress sensor for prognostic and health monitoring methods","volume-title":"Proc. Eur. Microelectronics Packag. Conf.","author":"Palczynska"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/tr.2024.3523892"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijsolstr.2017.05.005"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1007\/s10854-021-06573-3"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1061\/JMCEA3.0002029"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1007\/s10854-022-09294-3"}],"container-title":["IEEE Transactions on Reliability"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/24\/11273031\/11075599.pdf?arnumber=11075599","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,12,18]],"date-time":"2025-12-18T18:33:00Z","timestamp":1766082780000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11075599\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,12]]},"references-count":29,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tr.2025.3580345","relation":{},"ISSN":["0018-9529","1558-1721"],"issn-type":[{"type":"print","value":"0018-9529"},{"type":"electronic","value":"1558-1721"}],"subject":[],"published":{"date-parts":[[2025,12]]}}}