{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,10]],"date-time":"2026-02-10T18:04:24Z","timestamp":1770746664341,"version":"3.49.0"},"reference-count":98,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2026,1,1]],"date-time":"2026-01-01T00:00:00Z","timestamp":1767225600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,1,1]],"date-time":"2026-01-01T00:00:00Z","timestamp":1767225600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,1,1]],"date-time":"2026-01-01T00:00:00Z","timestamp":1767225600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Tianjin Municipal Science and Technology Program Project","award":["23ZGZNGX00040"],"award-info":[{"award-number":["23ZGZNGX00040"]}]},{"name":"Funding Project in the Technical Field of the Basic Strengthening Program","award":["2025-JCJQ-JJ-0850"],"award-info":[{"award-number":["2025-JCJQ-JJ-0850"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Rel."],"published-print":{"date-parts":[[2026]]},"DOI":"10.1109\/tr.2025.3647435","type":"journal-article","created":{"date-parts":[[2026,1,12]],"date-time":"2026-01-12T22:00:08Z","timestamp":1768255208000},"page":"819-832","source":"Crossref","is-referenced-by-count":0,"title":["Development and Practical Advances in Integrated Circuit Electromagnetic Reliability Over the Last Decade"],"prefix":"10.1109","volume":"75","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-9298-2675","authenticated-orcid":false,"given":"Ledong","family":"Chen","sequence":"first","affiliation":[{"name":"College of Electronic Science and Technology, National University of Defense Technology, Changsha, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0908-8614","authenticated-orcid":false,"given":"Jianfei","family":"Wu","sequence":"additional","affiliation":[{"name":" College of Electronic Science and Technology, National University of Defense Technology, Changsha, China"}]},{"given":"Honghai","family":"Liu","sequence":"additional","affiliation":[{"name":"College of Electronic Science and Technology, National University of Defense Technology, Changsha, China"}]},{"given":"Fukang","family":"Niu","sequence":"additional","affiliation":[{"name":"College of Electronic Science and Technology, National University of Defense Technology, Changsha, China"}]},{"given":"Linxi","family":"Huang","sequence":"additional","affiliation":[{"name":"College of Electronic Science and Technology, National University of Defense Technology, Changsha, China"}]},{"given":"Pingyun","family":"Jiang","sequence":"additional","affiliation":[{"name":"College of Electronic Science and Technology, National University of Defense Technology, Changsha, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3979-5771","authenticated-orcid":false,"given":"Jibin","family":"Liu","sequence":"additional","affiliation":[{"name":"College of Electronic Science and Technology, National University of Defense Technology, Changsha, China"}]}],"member":"263","reference":[{"key":"ref1","first-page":"208","article-title":"Electromagnetic robustness of ICs: From statement to prediction","volume-title":"Proc. 9th Int. Workshop EMC ICs","author":"Dhia"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2010.2048755"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/RFIT54256.2022.9882454"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/SBCCI55532.2022.9893237"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/austrochip61217.2023.10285159"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2015.2423314"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2016.2631731"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2016.2608981"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2016.2629702"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/LEMCPA.2021.3112574"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2014.2359032"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2017.2727047"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2016.2577738"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2016.2543246"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2013.2294256"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2015.7256303"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/EMCEurope51680.2022.9901286"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2017.2726560"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2017.2756915"},{"issue":"911","key":"ref20","doi-asserted-by":"crossref","first-page":"1493","DOI":"10.1016\/j.microrel.2011.07.053","article-title":"Control of the EMC: An issue for IC reliability","volume":"51","author":"Gros","year":"2011","journal-title":"Microelectron. Rel."},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2018.2889701"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/lemcpa.2020.2983687"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2015.2423314"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2017.2767084"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2015.2474124"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2015.2438053"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2016.2576564"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/tmag.2013.2242440"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/access.2021.3125051"},{"key":"ref30","first-page":"118","article-title":"Simulation of bulk current injection test using integrated circuit immunity macro model and EM analysis","volume-title":"Proc. Int. Symp. EMC-EMC Eur.","author":"Kondo"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/emceurope.2014.6931073"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/EMCCompo.2013.6735172"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2018.2890704"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2017.2729781"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2019.2944887"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/ICEPT.2014.6922951"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2023.3253385"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2020.113884"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2021.114335"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1007\/s41365-022-01017-x"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/ICEPT.2018.8480556"},{"key":"ref42","first-page":"45","article-title":"EMC engineering design manual","volume-title":"EMC Engineering Design Manual","author":"Chen","year":"1993"},{"issue":"8","key":"ref43","first-page":"62","article-title":"Introduction to mandatory EMC certification (3C certification)","volume":"30","author":"Li","year":"2002","journal-title":"Fluid Mach."},{"key":"ref44","first-page":"1","article-title":"EMC certification and management","volume":"2","author":"Teng","year":"2000","journal-title":"Saf. EMC"},{"key":"ref45","volume-title":"Measurement of EM Emissions, 150 kHz to 1 GHzPart 1: General Conditions and Definitions","year":"2002"},{"key":"ref46","volume-title":"Measurement of EM Emissions, 150 kHz to 1 GHzPart 2: Measurement of Radiated EmissionsTEM Cell and Wideband TEM Cell method","year":"2005"},{"key":"ref47","volume-title":"Measurement of EM EmissionsPart 3: Measurement of Radiated EmissionsSurface Scan Method","year":"2014"},{"key":"ref48","volume-title":"Measurement of EM Emissions, 150 kHz to 1 GHzPart 4: Measurement of Conducted Emissions1 Ohm150 Ohms Direct Coupling Method","year":"2006"},{"key":"ref49","volume-title":"Measurement of EM Emissions, 150 kHz to 1 GHzPart 5: Measurement of Conducted EmissionsWorkbench Faraday Cage Method","year":"2003"},{"key":"ref50","volume-title":"Measurement of EM Emissions, 150 kHz to 1 GHzPart 6: Measurement of Conducted EmissionsMagnetic Probe Method","year":"2008"},{"key":"ref51","volume-title":"Measurement of EM EmissionsPart 8: Measurement of Radiated EmissionsIC-Stripline Method","year":"2011"},{"key":"ref52","volume-title":"Measurement of EM Immunity, 150 kHz to 1 GHzPart 1: General Conditions and Definitions","year":"2006"},{"key":"ref53","volume-title":"Measurement of EM ImmunityPart 2: Measurement of Radiated ImmunityTEM Cell and Wideband TEM Cell Method","year":"2010"},{"key":"ref54","volume-title":"Measurement of EM Immunity, 150 kHz to 1 GHzPart 4: Direct RF Power Injection Method","year":"2006"},{"key":"ref55","volume-title":"Measurement of EM Immunity, 150 kHz to 1 GHzPart 5: Workbench Faraday Cage Method","year":"2005"},{"key":"ref56","volume-title":"Measurement of EM ImmunityPart 8: Measurement of Radiated ImmunityIC Stripline Method","year":"2012"},{"key":"ref57","volume-title":"Measurement of EM Immunity. Measurement of Radiated Immunity. Surface Scan Method","year":"2014"},{"key":"ref58","doi-asserted-by":"publisher","DOI":"10.1109\/EMCEurope.2018.8485082"},{"key":"ref59","volume-title":"Uncertainty Analysis in Electric Field Radiation Emission and Sensitivity Testing","author":"Xiang","year":"2014"},{"key":"ref60","article-title":""},{"key":"ref61","volume-title":"Failure Mechanism Based Stress Test Qualification for ICs","year":"2014"},{"key":"ref62","doi-asserted-by":"crossref","DOI":"10.1007\/978-3-030-23781-3","volume-title":"Ageing of ICs Causes, Effects and Mitigation Techniques","author":"Halak","year":"2020"},{"key":"ref63","volume-title":"Test Methods and Procedures for Microelectronic Devices","year":"2005"},{"key":"ref64","doi-asserted-by":"publisher","DOI":"10.1109\/tie.2013.2293695"},{"key":"ref65","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2014.07.131"},{"key":"ref66","first-page":"16","article-title":"Research progresses on electromagnetic compatibility of automotive-grade chips","volume":"4","author":"Wu","year":"2022","journal-title":"Saf. EMC"},{"key":"ref67","doi-asserted-by":"publisher","DOI":"10.1109\/lemcpa.2022.3210876"},{"key":"ref68","doi-asserted-by":"publisher","DOI":"10.1109\/access.2020.3015282"},{"key":"ref69","doi-asserted-by":"publisher","DOI":"10.1109\/APEMC53576.2022.9888305"},{"key":"ref70","first-page":"21","article-title":"Research progresses of integrated circuit electromagnetic compatibility measurement equipment of IC-stripline cell","volume":"4","author":"Wu","year":"2023","journal-title":"Saf. EMC"},{"key":"ref71","first-page":"69","article-title":"IEC 61967 Series-analysis on radiated emission tests methods of ICs","volume":"5","author":"Wang","year":"2021","journal-title":"China Integr. Circuit"},{"key":"ref72","doi-asserted-by":"publisher","DOI":"10.1109\/tim.2022.3175972"},{"key":"ref73","doi-asserted-by":"publisher","DOI":"10.1109\/tim.2022.3208656"},{"issue":"1","key":"ref74","first-page":"181","article-title":"Design of broadband IC-stripline cell based on transverse choke method","volume":"38","author":"Chen","year":"2023","journal-title":"Chin. J. Radio Sci."},{"key":"ref75","doi-asserted-by":"publisher","DOI":"10.3390\/electronics11172640"},{"key":"ref76","doi-asserted-by":"publisher","DOI":"10.1109\/EMCEUROPE48519.2020.9245726"},{"key":"ref77","doi-asserted-by":"publisher","DOI":"10.23919\/ACES57841.2023.10114698"},{"key":"ref78","doi-asserted-by":"publisher","DOI":"10.1109\/EMC\/SI\/PI\/EMCEurope52599.2021.9559151"},{"key":"ref79","doi-asserted-by":"publisher","DOI":"10.1109\/rsm52397.2021.9511571"},{"key":"ref80","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2013.07.124"},{"key":"ref81","doi-asserted-by":"publisher","DOI":"10.1109\/APEMC.2012.6237989"},{"key":"ref82","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2007.22"},{"key":"ref83","doi-asserted-by":"publisher","DOI":"10.1109\/ISOCC.2014.7087599"},{"key":"ref84","doi-asserted-by":"publisher","DOI":"10.1109\/tdmr.2021.3125344"},{"key":"ref85","doi-asserted-by":"publisher","DOI":"10.1109\/AUTEST.2012.6334580"},{"key":"ref86","doi-asserted-by":"publisher","DOI":"10.1109\/WiPDA49284.2021.9645100"},{"key":"ref87","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2019.2919710"},{"key":"ref88","doi-asserted-by":"publisher","DOI":"10.1109\/tvlsi.2015.2513379"},{"key":"ref89","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2017.2732028"},{"key":"ref90","doi-asserted-by":"publisher","DOI":"10.1109\/tie.2022.3163516"},{"issue":"6","key":"ref91","first-page":"41","article-title":"Shipborne GPS chip reliability improvement methods under high temperature and high moisture environment","volume":"37","author":"Yang","year":"2020","journal-title":"Integr. Circuit Appl."},{"key":"ref92","doi-asserted-by":"publisher","DOI":"10.1109\/JEDS.2023.3250356"},{"key":"ref93","doi-asserted-by":"publisher","DOI":"10.1109\/INMMiC46721.2020.9160341"},{"key":"ref94","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2019.00119"},{"key":"ref95","doi-asserted-by":"publisher","DOI":"10.1109\/icept.2018.8480600"},{"key":"ref96","doi-asserted-by":"publisher","DOI":"10.1109\/3D-PEIM49630.2021.9497262"},{"key":"ref97","doi-asserted-by":"publisher","DOI":"10.1109\/ICEPT56209.2022.9873298"},{"key":"ref98","first-page":"1","article-title":"Reliability prediction of bridgeless AC-DC SEPIC with V-fill for LED applications","volume-title":"Proc. Int. Conf. Power, Energy, Control Transmiss. Syst.","author":"Lakshmipraba"}],"container-title":["IEEE Transactions on Reliability"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/24\/11317936\/11342361.pdf?arnumber=11342361","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,2,10]],"date-time":"2026-02-10T05:58:02Z","timestamp":1770703082000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11342361\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026]]},"references-count":98,"URL":"https:\/\/doi.org\/10.1109\/tr.2025.3647435","relation":{},"ISSN":["0018-9529","1558-1721"],"issn-type":[{"value":"0018-9529","type":"print"},{"value":"1558-1721","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026]]}}}