{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,15]],"date-time":"2026-04-15T17:50:34Z","timestamp":1776275434965,"version":"3.50.1"},"reference-count":60,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"11","license":[{"start":{"date-parts":[[2021,11,1]],"date-time":"2021-11-01T00:00:00Z","timestamp":1635724800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,11,1]],"date-time":"2021-11-01T00:00:00Z","timestamp":1635724800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,11,1]],"date-time":"2021-11-01T00:00:00Z","timestamp":1635724800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"The Science and Technology Development Fund (FDCT), Macau, SAR","award":["0017\/2019\/A1"],"award-info":[{"award-number":["0017\/2019\/A1"]}]},{"name":"The Science and Technology Development Fund (FDCT), Macau, SAR","award":["005\/2018\/A1"],"award-info":[{"award-number":["005\/2018\/A1"]}]},{"name":"The Science and Technology Development Fund (FDCT), Macau, SAR","award":["011\/2017\/A"],"award-info":[{"award-number":["011\/2017\/A"]}]},{"name":"The Science and Technology Development Fund (FDCT), Macau, SAR","award":["122\/2017\/A3"],"award-info":[{"award-number":["122\/2017\/A3"]}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61803397"],"award-info":[{"award-number":["61803397"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61673123"],"award-info":[{"award-number":["61673123"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Syst. Man Cybern, Syst."],"published-print":{"date-parts":[[2021,11]]},"DOI":"10.1109\/tsmc.2020.2964032","type":"journal-article","created":{"date-parts":[[2020,1,22]],"date-time":"2020-01-22T21:33:50Z","timestamp":1579728830000},"page":"6792-6807","source":"Crossref","is-referenced-by-count":27,"title":["Closing-Down Optimization for Single-Arm Cluster Tools Subject to Wafer Residency Time Constraints"],"prefix":"10.1109","volume":"51","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-5162-0224","authenticated-orcid":false,"given":"Yan","family":"Qiao","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5408-8752","authenticated-orcid":false,"given":"Mengchu","family":"Zhou","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6782-458X","authenticated-orcid":false,"given":"Naiqi","family":"Wu","sequence":"additional","affiliation":[]},{"given":"Zhiwu","family":"Li","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2337-7041","authenticated-orcid":false,"given":"Qinghua","family":"Zhu","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"crossref","first-page":"303","DOI":"10.1109\/TASE.2008.2008633","article-title":"A closed-form solution for schedulability and optimal scheduling of dual-arm cluster tools with wafer residency time constraint based on steady schedule analysis","volume":"7","author":"wu","year":"2010","journal-title":"IEEE Trans Autom Sci Eng"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/TSMCA.2012.2187890"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/70.964662"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2017.2721979"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2016.2600583"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2014.2347928"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2008.2000425"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2012.2217128"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/66.641483"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1016\/j.omega.2009.04.002"},{"key":"ref60","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2017.2771751"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2014.2340858"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2013.2272702"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2014.2312823"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2015.2501232"},{"key":"ref1","first-page":"149","article-title":"Integrated processing equipment","volume":"33","author":"bader","year":"1990","journal-title":"Solid State Technol"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/j.ins.2015.08.037"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2003.810936"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1080\/00207179.2014.991940"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2016.2642997"},{"key":"ref23","first-page":"2117","article-title":"Integrated process planning and scheduling in flexible assemble job shop environment with sequence dependent setup times","volume":"6","author":"nourali","year":"2012","journal-title":"Int Journal of Math Analysis"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/66.536110"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/66.311340"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1109\/JAS.2017.7510772"},{"key":"ref51","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2007.906678"},{"key":"ref59","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2016.2531105"},{"key":"ref58","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2018.2874664"},{"key":"ref57","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2017.2690443"},{"key":"ref56","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2016.2530810"},{"key":"ref55","doi-asserted-by":"publisher","DOI":"10.1109\/70.964658"},{"key":"ref54","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2016.2598303"},{"key":"ref53","doi-asserted-by":"publisher","DOI":"10.1109\/TEM.2017.2785774"},{"key":"ref52","doi-asserted-by":"publisher","DOI":"10.1016\/j.ins.2017.07.009"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2012.2204980"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2003.815203"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2011.2178023"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2011.590949"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2012.2220355"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2013.2293552"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.cor.2011.08.022"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2013.2281083"},{"key":"ref17","first-page":"1","article-title":"Workload balancing and scheduling of a single-armed cluster tool","author":"lee","year":"2004","journal-title":"Proc 5th APIEMS Conf"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2005.851236"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1080\/00207721.2013.827257"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2010.2046891"},{"key":"ref3","first-page":"45","article-title":"Coping with the high cost of wafer fabs","volume":"38","author":"burggraaf","year":"1995","journal-title":"Semicond Int"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2006.879414"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.isatra.2018.11.025"},{"key":"ref8","article-title":"Steady state scheduling and modeling of multi-slot cluster tools","author":"jung","year":"2006"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2015.2507161"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2016.2587697"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2011.2180547"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2004.831948"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2014.2332138"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2016.2531697"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2015.2507140"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1016\/j.jclepro.2017.07.222"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2011.2160452"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1080\/17517575.2014.948936"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/MRA.2015.2415047"}],"container-title":["IEEE Transactions on Systems, Man, and Cybernetics: Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6221021\/9570757\/08966604.pdf?arnumber=8966604","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T14:53:09Z","timestamp":1652194389000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8966604\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,11]]},"references-count":60,"journal-issue":{"issue":"11"},"URL":"https:\/\/doi.org\/10.1109\/tsmc.2020.2964032","relation":{},"ISSN":["2168-2216","2168-2232"],"issn-type":[{"value":"2168-2216","type":"print"},{"value":"2168-2232","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021,11]]}}}