{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,7]],"date-time":"2026-03-07T08:14:59Z","timestamp":1772871299408,"version":"3.50.1"},"reference-count":40,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"Several Funding Sources, including the National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2021YFB3301701"],"award-info":[{"award-number":["2021YFB3301701"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["72231005"],"award-info":[{"award-number":["72231005"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"2019 Guangdong Special Support Talent Program\u2014Innovation and Entrepreneurship Leading Team, China","award":["2019BT02S593"],"award-info":[{"award-number":["2019BT02S593"]}]},{"name":"Departmental General Research Fund of PolyU","award":["P0045748"],"award-info":[{"award-number":["P0045748"]}]},{"name":"Projects of RIAM, PolyU","award":["P0046130"],"award-info":[{"award-number":["P0046130"]}]},{"name":"RGC Collaborative Research Fund","award":["C7076-22G"],"award-info":[{"award-number":["C7076-22G"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Syst. Man Cybern, Syst."],"published-print":{"date-parts":[[2023,12]]},"DOI":"10.1109\/tsmc.2023.3298927","type":"journal-article","created":{"date-parts":[[2023,8,15]],"date-time":"2023-08-15T17:40:17Z","timestamp":1692121217000},"page":"7513-7525","source":"Crossref","is-referenced-by-count":18,"title":["Real-Time Data-Driven Out-of-Order Synchronization for Production and Intralogistics in Multiresource-Constrained Assembly Systems"],"prefix":"10.1109","volume":"53","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-3202-0877","authenticated-orcid":false,"given":"Mingxing","family":"Li","sequence":"first","affiliation":[{"name":"School of Intelligent Systems Science and Engineering, Institute of Physical Internet, and the Guangdong International Cooperation Base of Science and Technology for GBA Smart Logistics, Jinan University, Zhuhai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4119-7340","authenticated-orcid":false,"given":"Ming","family":"Li","sequence":"additional","affiliation":[{"name":"Department of Industrial and Systems Engineering, Research Institute for Advanced Manufacturing, The Hong Kong Polytechnic University, Hong Kong, China"}]},{"given":"Daqiang","family":"Guo","sequence":"additional","affiliation":[{"name":"Department of Engineering, Centre for International Manufacturing, Institute for Manufacturing, University of Cambridge, Cambridge, U.K."}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1012-2856","authenticated-orcid":false,"given":"Ting","family":"Qu","sequence":"additional","affiliation":[{"name":"School of Intelligent Systems Science and Engineering, Institute of Physical Internet, and the Guangdong International Cooperation Base of Science and Technology for GBA Smart Logistics, Jinan University, Zhuhai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3592-7917","authenticated-orcid":false,"given":"George Q.","family":"Huang","sequence":"additional","affiliation":[{"name":"Department of Industrial and Systems Engineering, Research Institute for Advanced Manufacturing, The Hong Kong Polytechnic University, Hong Kong, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2013.2292569"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2014.2376471"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCYB.2021.3108546"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2019.1581957"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2022.2098874"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2017.2669212"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2017.1395491"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TEM.2017.2712611"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2020.3044698"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2017.2723764"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2018.2882838"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijpe.2021.108171"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1108\/IMDS-08-2020-0489"},{"key":"ref14","volume-title":"Computer Architecture: A Quantitative Approach","author":"Hennessy","year":"2011"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2017.1363427"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2018.2845683"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmsy.2020.10.015"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijpe.2021.108272"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmsy.2022.05.017"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1080\/0951192X.2020.1829059"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2021.3131849"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2021.3120702"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmsy.2018.01.006"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.compind.2021.103594"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1016\/j.compind.2020.103244"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/j.rcim.2021.102283"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1007\/s10845-020-01685-9"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1115\/MSEC2016-8506"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1016\/j.rcim.2019.101892"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1016\/j.rcim.2019.101917"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1007\/s10845-020-01727-2"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijpe.2005.09.001"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1007\/s11222-007-9033-z"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1016\/j.epsr.2020.106680"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2019.1677963"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1007\/s10845-015-1144-3"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2018.06.053"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1007\/springerreference_7187"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1016\/j.cie.2017.05.026"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1016\/j.ejor.2011.03.004"}],"container-title":["IEEE Transactions on Systems, Man, and Cybernetics: Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6221021\/10321815\/10218348.pdf?arnumber=10218348","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T19:24:33Z","timestamp":1709321073000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10218348\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,12]]},"references-count":40,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tsmc.2023.3298927","relation":{},"ISSN":["2168-2216","2168-2232"],"issn-type":[{"value":"2168-2216","type":"print"},{"value":"2168-2232","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,12]]}}}