{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,19]],"date-time":"2026-03-19T14:32:01Z","timestamp":1773930721401,"version":"3.50.1"},"reference-count":39,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"5","license":[{"start":{"date-parts":[[2024,5,1]],"date-time":"2024-05-01T00:00:00Z","timestamp":1714521600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,5,1]],"date-time":"2024-05-01T00:00:00Z","timestamp":1714521600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,5,1]],"date-time":"2024-05-01T00:00:00Z","timestamp":1714521600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100002920","name":"Hong Kong Research Grant Council","doi-asserted-by":"publisher","award":["16208520"],"award-info":[{"award-number":["16208520"]}],"id":[{"id":"10.13039\/501100002920","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002920","name":"Hong Kong Research Grant Council","doi-asserted-by":"publisher","award":["N_HKUST628\/22"],"award-info":[{"award-number":["N_HKUST628\/22"]}],"id":[{"id":"10.13039\/501100002920","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Science Foundation of China","doi-asserted-by":"publisher","award":["62261160385"],"award-info":[{"award-number":["62261160385"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Guangdong Scientific and Technological Project","award":["202002030323"],"award-info":[{"award-number":["202002030323"]}]},{"name":"Guangdong Scientific and Technological Project","award":["2014B 050505002"],"award-info":[{"award-number":["2014B 050505002"]}]},{"DOI":"10.13039\/501100012226","name":"Fundamental Research Funds for the Central Universities","doi-asserted-by":"publisher","award":["2023SMECP04"],"award-info":[{"award-number":["2023SMECP04"]}],"id":[{"id":"10.13039\/501100012226","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Syst. Man Cybern, Syst."],"published-print":{"date-parts":[[2024,5]]},"DOI":"10.1109\/tsmc.2024.3353802","type":"journal-article","created":{"date-parts":[[2024,1,31]],"date-time":"2024-01-31T18:37:00Z","timestamp":1706726220000},"page":"3097-3109","source":"Crossref","is-referenced-by-count":6,"title":["A Selective Migration-Based Improved GPR Modeling Method for Batch Process"],"prefix":"10.1109","volume":"54","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-7358-0454","authenticated-orcid":false,"given":"Kaihua","family":"Gao","sequence":"first","affiliation":[{"name":"Department of Chemical and Biological Engineering, Hong Kong University of Science and Technology, Hong Kong, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0269-4726","authenticated-orcid":false,"given":"Yuanqiang","family":"Zhou","sequence":"additional","affiliation":[{"name":"Department of Chemical and Biological Engineering, Hong Kong University of Science and Technology, Hong Kong, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4889-6438","authenticated-orcid":false,"given":"Jingyi","family":"Lu","sequence":"additional","affiliation":[{"name":"MOE Key Laboratory of Smart Manufacturing in Energy Chemical Process, East China University of Science and Technology, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5900-1353","authenticated-orcid":false,"given":"Furong","family":"Gao","sequence":"additional","affiliation":[{"name":"Department of Chemical and Biological Engineering, Hong Kong University of Science and Technology, Hong Kong, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TNNLS.2013.2285242"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1007\/s11814-022-1294-x"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2019.2931314"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCST.2018.2815545"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.engappai.2023.106424"},{"key":"ref6","volume-title":"Flexible Manufacturing System","author":"Shivanand","year":"2006"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2017.2672563"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2018.2874711"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.automatica.2021.110039"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2017.2782009"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2020.3031669"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1021\/acs.iecr.1c02706"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCST.2015.2420629"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCST.2019.2949757"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/LRA.2019.2926677"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/LRA.2021.3061307"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TNNLS.2014.2316291"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2021.3123310"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1002\/rnc.5361"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1021\/ie0704851"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1021\/ie800595a"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2803785"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1016\/j.cej.2010.11.097"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.ces.2015.04.045"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1007\/s11431-017-9320-9"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1021\/acs.iecr.1c00006"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1002\/aic.11822"},{"key":"ref28","first-page":"465","article-title":"PILCO: A model-based and dataefficient approach to policy search","volume-title":"Proc. 28th Int. Conf. Mach. Learn. (ICML)","author":"Deisenroth"},{"key":"ref29","volume-title":"Gaussian Processes for Machine Learning","volume":"2","author":"Williams","year":"2006"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.5555\/1046920.1194909"},{"key":"ref31","first-page":"1259","article-title":"Sparse Gaussian processes using pseudo-inputs","volume-title":"Proc. Adv. Neural Inf. Process. Syst. (NeurIPS)","author":"Snelson"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1016\/j.neucom.2017.10.028"},{"key":"ref33","article-title":"On the optimization of hyperparameters in Gaussian process regression","author":"Manzhos","year":"2021","journal-title":"arXiv:2112.01374"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmp.2018.03.001"},{"key":"ref35","first-page":"5","article-title":"Actively learning gaussian process dynamics","volume-title":"Proc. 2nd Annu. Conf. Learn. Dyn. Control","author":"Buisson-Fenet"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/IGARSS.2011.6049994"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1007\/1-84628-168-7"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1023\/A:1007601601278"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1016\/j.compchemeng.2016.04.025"}],"container-title":["IEEE Transactions on Systems, Man, and Cybernetics: Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6221021\/10500882\/10417063.pdf?arnumber=10417063","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,4,17]],"date-time":"2024-04-17T17:36:52Z","timestamp":1713375412000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10417063\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,5]]},"references-count":39,"journal-issue":{"issue":"5"},"URL":"https:\/\/doi.org\/10.1109\/tsmc.2024.3353802","relation":{},"ISSN":["2168-2216","2168-2232"],"issn-type":[{"value":"2168-2216","type":"print"},{"value":"2168-2232","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,5]]}}}