{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,3]],"date-time":"2026-03-03T07:24:19Z","timestamp":1772522659208,"version":"3.50.1"},"reference-count":49,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"6","license":[{"start":{"date-parts":[[2024,6,1]],"date-time":"2024-06-01T00:00:00Z","timestamp":1717200000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,6,1]],"date-time":"2024-06-01T00:00:00Z","timestamp":1717200000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,6,1]],"date-time":"2024-06-01T00:00:00Z","timestamp":1717200000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Liaoning Provincial Natural Science Foundation of China","award":["2023-MSBA-001"],"award-info":[{"award-number":["2023-MSBA-001"]}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["U21A20491"],"award-info":[{"award-number":["U21A20491"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["22178045"],"award-info":[{"award-number":["22178045"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100020950","name":"National Science and Technology Council, Taiwan","doi-asserted-by":"publisher","award":["NSTC 112-2221-E-007-105"],"award-info":[{"award-number":["NSTC 112-2221-E-007-105"]}],"id":[{"id":"10.13039\/501100020950","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100020950","name":"National Science and Technology Council, Taiwan","doi-asserted-by":"publisher","award":["NSTC 112-2221-E-033-053"],"award-info":[{"award-number":["NSTC 112-2221-E-033-053"]}],"id":[{"id":"10.13039\/501100020950","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Syst. Man Cybern, Syst."],"published-print":{"date-parts":[[2024,6]]},"DOI":"10.1109\/tsmc.2024.3359851","type":"journal-article","created":{"date-parts":[[2024,3,6]],"date-time":"2024-03-06T18:58:54Z","timestamp":1709751534000},"page":"3450-3460","source":"Crossref","is-referenced-by-count":3,"title":["Prognostics for Semiconductor Sustainability: Tool Failure Behavior Prediction in Fabrication Processes"],"prefix":"10.1109","volume":"54","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-2073-2375","authenticated-orcid":false,"given":"Li","family":"Zhu","sequence":"first","affiliation":[{"name":"Key Laboratory of Intelligent Control and Optimization for Industrial Equipment of Ministry of Education and the School of Control Science and Engineering, Dalian University of Technology, Dalian, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9994-839X","authenticated-orcid":false,"given":"Junghui","family":"Chen","sequence":"additional","affiliation":[{"name":"Department of Chemical Engineering, Chung-Yuan Christian University, Taoyuan, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3973-2295","authenticated-orcid":false,"given":"Chun-I","family":"Chen","sequence":"additional","affiliation":[{"name":"Western Digital Corporation, Magnetic Head Wafer Manufacturing Fab, Advanced Process Control Group, Fremont, CA, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2011.5763252"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ICIT.2017.7915579"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2834403"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1145\/1837274.1837280"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1080\/21681015.2015.1126654"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.7763\/IJET.2016.V8.898"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2015.2509247"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1007\/s10951-014-0381-1"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2016.2574130"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2017.2676245"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2014.2374339"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.36001\/ijphm.2017.v8i3.2667"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2017.2697842"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JAS.2021.1003859"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.energy.2018.02.016"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2017.2662478"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-009-2482-0"},{"key":"ref18","volume-title":"Method and apparatus for simulating manufacturing, electrical and physical characteristics of a semiconductor device","author":"Okada","year":"2004"},{"key":"ref19","volume-title":"System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process","author":"Mitrovic","year":"2011"},{"key":"ref20","article-title":"Predictive modeling for intelligent maintenance in complex semiconductor manufacturing processes","author":"Liu","year":"2008"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-662-59084-3_1"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.procir.2018.03.280"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1016\/j.cirp.2017.04.007"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.procir.2021.11.307"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.3390\/pr10112173"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/j.compind.2020.103335"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1016\/j.cie.2020.106889"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.23919\/ChiCC.2017.8028970"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1016\/S0005-1098(00)00084-4"},{"key":"ref30","first-page":"6","article-title":"A review of related work on machine learning in semiconductor manufacturing and assembly lines","volume-title":"Proc. 1st Int. Workshop Sci., Appl. Methods Ind. 4.0 Co-Locat. With (i-KNOW)","author":"Stanisavljevic"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/JAS.2019.1911804"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/66.857947"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/ACC.2008.4586721"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2002.804901"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2009.2030793"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1007\/s10696-012-9161-4"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1080\/09537280500213757"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2015.2481719"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2007.02.014"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2013.775525"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1016\/j.jprocont.2017.12.004"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1016\/j.rcim.2011.06.007"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1016\/j.enconman.2019.05.023"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmva.2004.01.006"},{"key":"ref45","volume-title":"Gaussian Processes For Machine Learning","author":"Williams","year":"2006"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.36001\/phmconf.2013.v5i1.2773"},{"issue":"2","key":"ref47","first-page":"177","article-title":"MSET performance optimization through regularization","volume":"37","author":"Hines","year":"2005","journal-title":"Nucl. Eng. Technol."},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2015.2409299"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2014.2321192"}],"container-title":["IEEE Transactions on Systems, Man, and Cybernetics: Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6221021\/10532209\/10461562.pdf?arnumber=10461562","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,5,17]],"date-time":"2024-05-17T17:45:45Z","timestamp":1715967945000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10461562\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,6]]},"references-count":49,"journal-issue":{"issue":"6"},"URL":"https:\/\/doi.org\/10.1109\/tsmc.2024.3359851","relation":{},"ISSN":["2168-2216","2168-2232"],"issn-type":[{"value":"2168-2216","type":"print"},{"value":"2168-2232","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,6]]}}}