{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,13]],"date-time":"2026-01-13T02:30:32Z","timestamp":1768271432374,"version":"3.49.0"},"reference-count":7,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2002,6,1]],"date-time":"2002-06-01T00:00:00Z","timestamp":1022889600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2002,6,1]],"date-time":"2002-06-01T00:00:00Z","timestamp":1022889600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2002,6,1]],"date-time":"2002-06-01T00:00:00Z","timestamp":1022889600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2002,6]]},"DOI":"10.1109\/tvlsi.2002.1043331","type":"journal-article","created":{"date-parts":[[2003,1,3]],"date-time":"2003-01-03T17:55:00Z","timestamp":1041616500000},"page":"286-291","source":"Crossref","is-referenced-by-count":61,"title":["Expression of Concern: Simulation and modeling of the effect of substrate conductivity on coupling inductance and circuit crosstalk"],"prefix":"10.1109","volume":"10","author":[{"given":"Y.","family":"Massoud","sequence":"first","affiliation":[{"name":"Synopsys Inc., Mountain View, CA, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J.","family":"White","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","volume-title":"Electromagnetic Fields and Energy","author":"Haus","year":"1989"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/22.310584"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1147\/rd.236.0661"},{"key":"ref4","volume-title":"Circuit Analysis, Simulation and Design","author":"Ling","year":"1988"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/33.52864"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/332357.332386"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/22.146331"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/92\/22365\/01043331.pdf?arnumber=1043331","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,27]],"date-time":"2024-03-27T19:53:41Z","timestamp":1711569221000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/1043331\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2002,6]]},"references-count":7,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2002.1043331","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2002,6]]}}}