{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,4,2]],"date-time":"2022-04-02T22:06:07Z","timestamp":1648937167648},"reference-count":17,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2012,1,1]],"date-time":"2012-01-01T00:00:00Z","timestamp":1325376000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2012,1]]},"DOI":"10.1109\/tvlsi.2010.2090368","type":"journal-article","created":{"date-parts":[[2010,12,10]],"date-time":"2010-12-10T15:33:55Z","timestamp":1291995235000},"page":"162-166","source":"Crossref","is-referenced-by-count":0,"title":["An Experimental Power-Lines Model for Digital ASICs Based on Transmission Lines"],"prefix":"10.1109","volume":"20","author":[{"given":"M.","family":"Costagliola","sequence":"first","affiliation":[]},{"given":"D.","family":"de Caro","sequence":"additional","affiliation":[]},{"given":"A.","family":"Girardi","sequence":"additional","affiliation":[]},{"given":"R.","family":"Izzi","sequence":"additional","affiliation":[]},{"given":"N.","family":"Rinaldi","sequence":"additional","affiliation":[]},{"given":"M.","family":"Spirito","sequence":"additional","affiliation":[]},{"given":"P.","family":"Spirito","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","first-page":"177","article-title":"Importance of on-chip inductance in designing RLC VLSI interconnects","author":"falah","year":"2002","journal-title":"Proc Int Conf Microelectron"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2005.861726"},{"key":"ref12","doi-asserted-by":"crossref","first-page":"470","DOI":"10.1109\/6040.861562","article-title":"S-parameter-measurement-based high-speed signal transient characterization of VLSI interconnects on SiO2-Si substrate","volume":"23","author":"yungseon","year":"2000","journal-title":"IEEE Trans Adv Packag"},{"key":"ref13","year":"1996","journal-title":"Analyse und modellierung der gesamtdaempfungsverluste von verlustbehafteten streifenleitungen"},{"key":"ref14","year":"0","journal-title":"idem"},{"key":"ref15","author":"bard","year":"1974","journal-title":"Non Linear Parameter Estimation"},{"key":"ref16","author":"comincioli","year":"1990","journal-title":"Analisi Numerica Modelli Applicazioni"},{"key":"ref17","first-page":"529","article-title":"Modeling and simulation of hybrid RF circuits using a versatile compact bond wire model","volume":"2","author":"harm","year":"1998","journal-title":"Proc Eur Microw Conf"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/6144.774752"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.1994.527960"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.1983.1270037"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1983.1051966"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/43.664231"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/43.45868"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/VTEST.1997.599458"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/96.533886"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/92.805751"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/92\/6099858\/05648762.pdf?arnumber=5648762","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,10,10]],"date-time":"2021-10-10T23:47:03Z","timestamp":1633909623000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5648762\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,1]]},"references-count":17,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2010.2090368","relation":{},"ISSN":["1063-8210"],"issn-type":[{"value":"1063-8210","type":"print"}],"subject":[],"published":{"date-parts":[[2012,1]]}}}