{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,7,4]],"date-time":"2024-07-04T21:54:37Z","timestamp":1720130077460},"reference-count":14,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2013,3,1]],"date-time":"2013-03-01T00:00:00Z","timestamp":1362096000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2013,3]]},"DOI":"10.1109\/tvlsi.2012.2190148","type":"journal-article","created":{"date-parts":[[2012,4,20]],"date-time":"2012-04-20T15:55:45Z","timestamp":1334937345000},"page":"465-474","source":"Crossref","is-referenced-by-count":6,"title":["Low-Cost Error Tolerance Scheme for 3-D CMOS Imagers"],"prefix":"10.1109","volume":"21","author":[{"given":"Hsiu-Ming Chang","family":"Chang","sequence":"first","affiliation":[]},{"given":"Jiun-Lang","family":"Huang","sequence":"additional","affiliation":[]},{"given":"Ding-Ming","family":"Kwai","sequence":"additional","affiliation":[]},{"given":"Kwang-Ting","family":"Cheng","sequence":"additional","affiliation":[]},{"given":"Cheng-Wen","family":"Wu","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","first-page":"68221j-1","article-title":"Image demosaicing: A systematic survey","volume":"6822","author":"li","year":"2008","journal-title":"Proc SPIE Visual Commun Image Process"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/79.952804"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1137\/040616024"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/MCD.2005.1438751"},{"key":"ref14","year":"0","journal-title":"Kodak Lossless True Color Image Suite"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2006.1645677"},{"key":"ref3","first-page":"356","article-title":"Megapixel CMOS image sensor fabricated in 3-D integrated circuit technology","author":"suntharalingam","year":"2005","journal-title":"Proc Int Solid-State Circuits Conf"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1557\/PROC-1112-E01-03"},{"key":"ref5","first-page":"38","article-title":"A 4-side tileable back illuminated 3-D-integrated Mpixel CMOS image sensor","author":"suntharalingam","year":"2009","journal-title":"Proc Int Solid-State Circuits Conf"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/1837274.1837505"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681638"},{"key":"ref2","first-page":"268","article-title":"3-D integrated circuits for low-power, high-bandwidth systems on a chip","author":"burns","year":"2001","journal-title":"Proc Int Solid-State Circuits Conf"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.136"},{"key":"ref9","year":"1976","journal-title":"Color imaging array"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/92\/6466554\/06186837.pdf?arnumber=6186837","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,11,29]],"date-time":"2021-11-29T20:56:14Z","timestamp":1638219374000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6186837\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,3]]},"references-count":14,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2012.2190148","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2013,3]]}}}