{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,30]],"date-time":"2026-01-30T03:53:57Z","timestamp":1769745237265,"version":"3.49.0"},"reference-count":19,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2014,3,1]],"date-time":"2014-03-01T00:00:00Z","timestamp":1393632000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2014,3]]},"DOI":"10.1109\/tvlsi.2013.2246876","type":"journal-article","created":{"date-parts":[[2013,3,11]],"date-time":"2013-03-11T18:02:18Z","timestamp":1363024938000},"page":"655-666","source":"Crossref","is-referenced-by-count":10,"title":["Integrated Algorithm for 3-D IC Through-Silicon Via Assignment"],"prefix":"10.1109","volume":"22","author":[{"given":"Xiaodong","family":"Liu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gary","family":"Yeap","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jun","family":"Tao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xuan","family":"Zeng","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/SFCS.1998.743463"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TSSC.1968.300136"},{"key":"ref12","doi-asserted-by":"crossref","first-page":"674","DOI":"10.1145\/1687399.1687524","article-title":"A study of Through-Silicon-Via impact on the 3D stacked IC layout","author":"kim","year":"2009","journal-title":"Proc IEEE Int Conf Comput -Aided Design"},{"key":"ref13","author":"knuth","year":"1993","journal-title":"The Stanford GraphBase A Platform for Combinatorial Computing"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1002\/nav.3800020109"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/2024724.2024873"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2008.2007462"},{"key":"ref17","first-page":"387","article-title":"Through-silicon-via management during 3D physical design: When to add and how many?","author":"pathak","year":"2010","journal-title":"Proc IEEE Int Conf Comput -Aided Design"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1007\/BF02579324"},{"key":"ref19","doi-asserted-by":"crossref","DOI":"10.1007\/978-0-387-74388-2","volume":"114","author":"vanderbei","year":"2008","journal-title":"Linear Programming Foundation and Extensions"},{"key":"ref4","author":"cormen","year":"2001","journal-title":"Introduction to Algorithms"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2002.994986"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2009.5074039"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/43.986421"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1137\/S0895480199355754"},{"key":"ref7","first-page":"1","article-title":"Via assignment algorithm for hierarchical 3D placement","author":"fang","year":"2005","journal-title":"Proc IEEE Int Conf Commun Circuits Syst"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/43.920691"},{"key":"ref1","author":"ahuja","year":"1993","journal-title":"Network Flows Theory Algorithms and Applications"},{"key":"ref9","author":"garey","year":"1979","journal-title":"Computer and Intractability A Guide to the Theory of NP-Completeness"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/6746074\/06477163.pdf?arnumber=6477163","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,5,7]],"date-time":"2024-05-07T08:40:22Z","timestamp":1715071222000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6477163\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,3]]},"references-count":19,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2013.2246876","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2014,3]]}}}