{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T03:24:39Z","timestamp":1648783479654},"reference-count":28,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2014,4,1]],"date-time":"2014-04-01T00:00:00Z","timestamp":1396310400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2014,4]]},"DOI":"10.1109\/tvlsi.2013.2256378","type":"journal-article","created":{"date-parts":[[2014,3,18]],"date-time":"2014-03-18T18:04:22Z","timestamp":1395165862000},"page":"878-887","source":"Crossref","is-referenced-by-count":4,"title":["Temperature Sensing RRAM Architecture for 3-D ICs"],"prefix":"10.1109","volume":"22","author":[{"given":"Cory E.","family":"Merkel","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dhireesha","family":"Kudithipudi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","first-page":"1","article-title":"Temperature measurement in the Intel Core Duo processor","author":"rotem","year":"2006","journal-title":"Proc 12th Int Workshop Thermal Invest"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/1400112.1400114"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1063\/1.3640806"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/PROC.1976.10092"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1038\/nature06932"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevA.21.681"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1063\/1.3484038"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201102597"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1038\/nmat2748"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1145\/1785481.1785548"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2009.5306582"},{"key":"ref28","author":"dellaquila","year":"2010","journal-title":"Thermal profiling of homogeneous multi-core processors using sensor mini-networks"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IJCNN.2011.6033622"},{"key":"ref27","year":"2000","journal-title":"Standard Performance Evaluation Council Performance Evaluation in the New Millennium Version 1 1"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/VLSID.2012.65"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1007\/s00339-011-6296-1"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/DSN.2004.1311888"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/378239.379025"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1088\/0957-4484\/21\/41\/412001"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1007\/s00339-008-4975-3"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/5.929647"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1088\/0957-4484\/20\/42\/425204"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1145\/268806.268810"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1145\/1531542.1531653"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1145\/2206781.2206824"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/HIS.2001.946702"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1145\/980152.980157"},{"key":"ref25","first-page":"83","article-title":"Wattch: a framework for architectural-level power analysis and optimizations","author":"brooks","year":"2000","journal-title":"Proceedings of 27th International Symposium on Computer Architecture (IEEE Cat No RS00201) ISCA"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/6774899\/06515635.pdf?arnumber=6515635","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:31:44Z","timestamp":1642005104000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/6515635\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,4]]},"references-count":28,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2013.2256378","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2014,4]]}}}