{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,7]],"date-time":"2026-01-07T07:54:57Z","timestamp":1767772497047},"reference-count":19,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"11","license":[{"start":{"date-parts":[[2014,11,1]],"date-time":"2014-11-01T00:00:00Z","timestamp":1414800000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"name":"National Research Foundation of Korea Grant funded by the Korean Government","award":["2012R1A2A1A03006255"],"award-info":[{"award-number":["2012R1A2A1A03006255"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2014,11]]},"DOI":"10.1109\/tvlsi.2013.2289964","type":"journal-article","created":{"date-parts":[[2014,1,31]],"date-time":"2014-01-31T17:51:40Z","timestamp":1391190700000},"page":"2380-2387","source":"Crossref","is-referenced-by-count":26,"title":["A Delay Test Architecture for TSV With Resistive Open Defects in 3-D Stacked Memories"],"prefix":"10.1109","volume":"22","author":[{"given":"Hyungsu","family":"Sung","sequence":"first","affiliation":[]},{"given":"Keewon","family":"Cho","sequence":"additional","affiliation":[]},{"given":"Kunsang","family":"Yoon","sequence":"additional","affiliation":[]},{"given":"Sungho","family":"Kang","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/APCCAS.2010.5775087"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2011.5783749"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2009.5306569"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681638"},{"key":"ref14","first-page":"1031","article-title":"Small delay testing for TSVs in 3D ICs","author":"lin","year":"2012","journal-title":"Proc Design Autom Conf"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2034508"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2010.73"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228545"},{"key":"ref18","first-page":"10","article-title":"The influence of the size effect of copper interconnects on RC delay variability beyond 45 nm technology","author":"kitada","year":"2007","journal-title":"Proc IEEE Int Interconnect Technol Conf"},{"key":"ref19","first-page":"150","article-title":"Electrical wire models","author":"rabaey","year":"2003","journal-title":"Digital Integrated Circuit A design perspective"},{"key":"ref4","doi-asserted-by":"crossref","DOI":"10.1002\/9783527623051","author":"garrou","year":"2008","journal-title":"Handbook of 3D Integration Technology and Applications of 3D Integrated Circuits"},{"key":"ref3","first-page":"212","article-title":"Extending systems-on-chip to the third dimension: Performance, cost and technological tradeoffs","author":"weerasekera","year":"2007","journal-title":"Proc Int Conf Comput -Aided Design"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2011.2166961"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2009.42"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2009.125"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2011.37"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2007.59"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2034408"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2009.5355573"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/6932540\/06674065.pdf?arnumber=6674065","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:24:28Z","timestamp":1642004668000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/6674065"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,11]]},"references-count":19,"journal-issue":{"issue":"11"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2013.2289964","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2014,11]]}}}