{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,18]],"date-time":"2026-02-18T22:34:45Z","timestamp":1771454085130,"version":"3.50.1"},"reference-count":11,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"11","license":[{"start":{"date-parts":[[2014,11,1]],"date-time":"2014-11-01T00:00:00Z","timestamp":1414800000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/OAPA.html"}],"funder":[{"DOI":"10.13039\/100000001","name":"National Science Foundation","doi-asserted-by":"publisher","award":["CCF-1337167"],"award-info":[{"award-number":["CCF-1337167"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100000001","name":"National Science Foundation","doi-asserted-by":"publisher","award":["IIA-1331332"],"award-info":[{"award-number":["IIA-1331332"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100000001","name":"National Science Foundation","doi-asserted-by":"publisher","award":["IIP-1238321"],"award-info":[{"award-number":["IIP-1238321"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100000028","name":"Semiconductor Research Corporation","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100000028","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2014,11]]},"DOI":"10.1109\/tvlsi.2013.2290132","type":"journal-article","created":{"date-parts":[[2014,1,31]],"date-time":"2014-01-31T12:51:40Z","timestamp":1391172700000},"page":"2411-2417","source":"Crossref","is-referenced-by-count":1,"title":["Runtime Self-Calibrated Temperature\u2013Stress Cosensor for 3-D Integrated Circuits"],"prefix":"10.1109","volume":"22","author":[{"given":"Chun","family":"Zhang","sequence":"first","affiliation":[{"name":"Department of Electrical and Computer Engineering, Missouri University of Science and Technology, Rolla, MO, USA"}]},{"given":"Dian","family":"Ma","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, Missouri University of Science and Technology, Rolla, MO, USA"}]},{"given":"Changzhi","family":"Li","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, Texas Tech University, Lubbock, TX, USA"}]},{"given":"Yiyu","family":"Shi","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, Missouri University of Science and Technology, Rolla, MO, USA"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.1998.689524"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2010.2040730"},{"key":"ref10","doi-asserted-by":"crossref","DOI":"10.1007\/1-4020-5258-8","author":"pertijs","year":"2006","journal-title":"Precision Temperature Sensors in CMOS Technology"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2006.870140"},{"key":"ref11","author":"wolpert","year":"2011","journal-title":"Managing Temperature Effects in Nanoscale Adaptive Systems"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICMTS.2010.5466836"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2011.6055295"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2013.2249131"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2012.6271942"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2035553"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1049\/el.2012.0318"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/6932540\/06675079.pdf?arnumber=6675079","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,2,18]],"date-time":"2026-02-18T21:26:10Z","timestamp":1771449970000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/6675079\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,11]]},"references-count":11,"journal-issue":{"issue":"11"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2013.2290132","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2014,11]]}}}