{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,7]],"date-time":"2026-01-07T08:10:53Z","timestamp":1767773453064,"version":"3.37.3"},"reference-count":21,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"8","license":[{"start":{"date-parts":[[2015,8,1]],"date-time":"2015-08-01T00:00:00Z","timestamp":1438387200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"DOI":"10.13039\/501100000266","name":"Engineering and Physical Sciences Research Council","doi-asserted-by":"publisher","award":["EP\/K000810\/1"],"award-info":[{"award-number":["EP\/K000810\/1"]}],"id":[{"id":"10.13039\/501100000266","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Department of Electrical Engineering and Electronics, University of Liverpool, Merseyside, U.K."}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/tvlsi.2014.2343156","type":"journal-article","created":{"date-parts":[[2014,8,15]],"date-time":"2014-08-15T15:44:24Z","timestamp":1408117464000},"page":"1567-1571","source":"Crossref","is-referenced-by-count":38,"title":["Online Fault Tolerance Technique for TSV-Based 3-D-IC"],"prefix":"10.1109","volume":"23","author":[{"given":"Yi","family":"Zhao","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Saqib","family":"Khursheed","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bashir M.","family":"Al-Hashimi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","article-title":"TSV open defects in 3D integrated circuits: Characterization, test, and optimal spare allocation","author":"fangming","year":"2012","journal-title":"Proc 49th Design Autom Conf (DAC)"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.1109\/ATS.2011.37"},{"doi-asserted-by":"publisher","key":"ref12","DOI":"10.1109\/ICCAD.2008.4681638"},{"doi-asserted-by":"publisher","key":"ref13","DOI":"10.1109\/JSSC.2009.2034408"},{"key":"ref14","first-page":"166","article-title":"TSV redundancy: Architecture and design issues in 3D IC","author":"hsieh","year":"2010","journal-title":"Proc Design Autom Test Eur (DATE)"},{"doi-asserted-by":"publisher","key":"ref15","DOI":"10.1109\/DATE.2012.6176602"},{"doi-asserted-by":"publisher","key":"ref16","DOI":"10.1145\/2463209.2488824"},{"doi-asserted-by":"publisher","key":"ref17","DOI":"10.1109\/TED.2009.2034508"},{"year":"2014","author":"zhao","article-title":"Design and validation of online fault tolerance architecture for TSV-based 3D-IC","key":"ref18"},{"doi-asserted-by":"publisher","key":"ref19","DOI":"10.1109\/TVLSI.2013.2239319"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1109\/EPTC.2010.5702657"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1109\/IEDM.2005.1609348"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.1109\/EPTC.2010.5702655"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1109\/ECTC.2011.5898700"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1109\/ATS.2009.42"},{"doi-asserted-by":"publisher","key":"ref7","DOI":"10.1109\/ICCAD.2010.5654255"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1145\/1412587.1412593"},{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.1109\/5.929647"},{"doi-asserted-by":"publisher","key":"ref9","DOI":"10.1145\/2228360.2228546"},{"year":"2005","journal-title":"IWLS'05 Benchmark Circuits","key":"ref20"},{"doi-asserted-by":"publisher","key":"ref21","DOI":"10.1145\/2024724.2024876"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/7164363\/06879321.pdf?arnumber=6879321","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T11:42:09Z","timestamp":1641987729000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/6879321\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":21,"journal-issue":{"issue":"8"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2014.2343156","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"type":"print","value":"1063-8210"},{"type":"electronic","value":"1557-9999"}],"subject":[],"published":{"date-parts":[[2015,8]]}}}