{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T10:21:19Z","timestamp":1740133279473,"version":"3.37.3"},"reference-count":34,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"9","license":[{"start":{"date-parts":[[2015,9,1]],"date-time":"2015-09-01T00:00:00Z","timestamp":1441065600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"name":"973 Project","award":["2013CB329000"],"award-info":[{"award-number":["2013CB329000"]}]},{"name":"National Science and Technology Major Project","award":["2010ZX01030-001-001-04"],"award-info":[{"award-number":["2010ZX01030-001-001-04"]}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61373026","61261160501","61028006"],"award-info":[{"award-number":["61373026","61261160501","61028006"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Tsinghua University Initiative Scientific Research Program"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2015,9]]},"DOI":"10.1109\/tvlsi.2014.2354347","type":"journal-article","created":{"date-parts":[[2014,9,18]],"date-time":"2014-09-18T14:55:18Z","timestamp":1411052118000},"page":"1842-1853","source":"Crossref","is-referenced-by-count":3,"title":["Whitespace-Aware TSV Arrangement in 3-D Clock Tree Synthesis"],"prefix":"10.1109","volume":"23","author":[{"given":"Wulong","family":"Liu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yu","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Guoqing","family":"Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuchun","family":"Ma","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuan","family":"Xie","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Huazhong","family":"Yang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"Predictive Technology Model","year":"0","key":"ref33"},{"journal-title":"ISPD’09 Benchmarks","year":"0","key":"ref32"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228559"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/82.204128"},{"journal-title":"Ngspice","year":"0","key":"ref34"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2007.364459"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2011.5722264"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2013.6509681"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2013.2270285"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/1837274.1837456"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2212193"},{"key":"ref16","first-page":"2654","article-title":"Synthesis of 3D clock tree with pre-bond testability","author":"wang","year":"2013","journal-title":"Proc IEEE ISCAS"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2008.4484003"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2010.5419833"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2012.6164971"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2050012"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/GREENCOMP.2010.5598269"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/EPEPS.2009.5338469"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/2024724.2024875"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/2003695.2003708"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/DAC.1990.114920"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2010.5419900"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/1687399.1687433"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2010.2099590"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2010.5653703"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2010.2098130"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/1148015.1148016"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2013.6654632"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2009.5416458"},{"key":"ref21","first-page":"1","article-title":"TSV modeling and noise coupling in 3D IC","author":"kim","year":"2010","journal-title":"Proc 3rd ESTC"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2011.5770714"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1145\/2024724.2024900"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2013.6691133"},{"key":"ref25","first-page":"35.1.1","article-title":"Investigation on TSV impact on 65 nm CMOS devices and circuits","author":"chaabouni","year":"2010","journal-title":"Proc IEEE IEDM"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/7217857\/06902809.pdf?arnumber=6902809","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T11:41:38Z","timestamp":1641987698000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/6902809"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,9]]},"references-count":34,"journal-issue":{"issue":"9"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2014.2354347","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"type":"print","value":"1063-8210"},{"type":"electronic","value":"1557-9999"}],"subject":[],"published":{"date-parts":[[2015,9]]}}}