{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,3,14]],"date-time":"2024-03-14T02:09:44Z","timestamp":1710382184586},"reference-count":46,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2015,12,1]],"date-time":"2015-12-01T00:00:00Z","timestamp":1448928000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2015,12]]},"DOI":"10.1109\/tvlsi.2014.2379263","type":"journal-article","created":{"date-parts":[[2015,1,1]],"date-time":"2015-01-01T19:35:19Z","timestamp":1420140919000},"page":"2931-2944","source":"Crossref","is-referenced-by-count":6,"title":["Coupling Mitigation in 3-D Multiple-Stacked Devices"],"prefix":"10.1109","volume":"23","author":[{"given":"Pooria M.","family":"Yaghini","sequence":"first","affiliation":[]},{"given":"Ashkan","family":"Eghbal","sequence":"additional","affiliation":[]},{"given":"Misagh","family":"Khayambashi","sequence":"additional","affiliation":[]},{"given":"Nader","family":"Bagherzadeh","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref39","first-page":"1","article-title":"Global built-in self-repair for 3D memories with redundancy sharing and parallel testing","author":"wang","year":"2012","journal-title":"Proc IEEE Int 3D Syst Integr Conf (3DIC)"},{"key":"ref38","year":"2012","journal-title":"Pin - A dynamic binary instrumentation tool"},{"key":"ref33","first-page":"70","article-title":"A 5.2 GHz microprocessor chip for the IBM zEnterprise system","author":"warnock","year":"2011","journal-title":"IEEE Int Solid-State Circuits Conf Dig Tech Papers (ISSCC)"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1002\/mop.26021"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2011.5722180"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2012.2193840"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1145\/1454115.1454128"},{"key":"ref36","year":"2012","journal-title":"Predictive Technology Model"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2012.2187081"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2034508"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1145\/2024724.2024900"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2011.5937902"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1002\/mop.26021"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2026200"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2009.5306541"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ETS.2013.6569349"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.338"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/DFT.2014.6962067"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ICEIE.2010.5559865"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/DTIS.2011.5941443"},{"key":"ref19","first-page":"29","article-title":"Deflection routing in 3D network-on-chip with TSV serialization","author":"lee","year":"2013","journal-title":"Asia South Pacific Design Autom Conf (ASP-DAC)"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2338862"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2009.5416490"},{"key":"ref27","year":"2013","journal-title":"Table INTC7—ITRS 2013 Executive Summary"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2009.5416458"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2012.06.021"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6176969"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/2494536"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2012.6165055"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2009.5090673"},{"key":"ref2","year":"2014","journal-title":"The 43rd TOP500 List"},{"key":"ref9","year":"2014","journal-title":"ITRS 2012 Executive Summary"},{"key":"ref1","article-title":"The opportunities and challenges of exascale computing","author":"ashby","year":"2010"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.326"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2012.6242474"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/DSD.2011.12"},{"key":"ref22","year":"2014","journal-title":"Hybrid Memory Cube"},{"key":"ref21","first-page":"1","article-title":"Hybrid memory cube (HMC)","author":"pawlowski","year":"2011","journal-title":"Proc Hot Chips"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2010.5699217"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2182067"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1016\/j.sysarc.2010.10.003"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2011.239"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/ICECC.2011.6067826"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2010.09.031"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1177\/1094342009347767"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/IOLTS.2010.5560225"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/7333028\/07001101.pdf?arnumber=7001101","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:28:05Z","timestamp":1642004885000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7001101\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,12]]},"references-count":46,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2014.2379263","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2015,12]]}}}