{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,27]],"date-time":"2026-05-27T18:22:49Z","timestamp":1779906169425,"version":"3.53.1"},"reference-count":38,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2017,2,1]],"date-time":"2017-02-01T00:00:00Z","timestamp":1485907200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"name":"HiPer Consortium under the Magnet program of the office of the chief scientist in the Israeli Ministry of Economy"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2017,2]]},"DOI":"10.1109\/tvlsi.2016.2603923","type":"journal-article","created":{"date-parts":[[2016,9,8]],"date-time":"2016-09-08T18:26:58Z","timestamp":1473359218000},"page":"502-509","source":"Crossref","is-referenced-by-count":32,"title":["Area and Energy-Efficient Complementary Dual-Modular Redundancy Dynamic Memory for Space Applications"],"prefix":"10.1109","volume":"25","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-3845-4580","authenticated-orcid":false,"given":"Robert","family":"Giterman","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lior","family":"Atias","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Adam","family":"Teman","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1049\/joe.2013.0057"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2010.2084100"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2008.2006795"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2015.2394459"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.3390\/jlpea3020054"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/SISPAD.2013.6650574"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.2007155"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2128150"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2007.912983"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2005.856543"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2006.4380799"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/23.556880"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2009.2032090"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.3390\/jlpea5020130"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2011.2168828"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2015.7338366"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.1972.1155044"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2000.852812"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2004.842854"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2014.2305016"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.69"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/S3S.2013.6716579"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2012.6241810"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/EEEI.2014.7005796"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2004.826321"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2220671"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2003.1269335"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2007.892119"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2010.2047907"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2008.2005583"},{"key":"ref1","year":"2015","journal-title":"International Technology Roadmap for Semiconductors2005 Edition"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2168729"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2005.853449"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2014.6865600"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.873215"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2003.813129"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/IOLTS.2012.6313834"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.2002.996639"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/7827022\/07563385.pdf?arnumber=7563385","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:20:17Z","timestamp":1642004417000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7563385\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,2]]},"references-count":38,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2016.2603923","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2017,2]]}}}