{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,29]],"date-time":"2026-03-29T16:33:33Z","timestamp":1774802013109,"version":"3.50.1"},"reference-count":38,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"6","license":[{"start":{"date-parts":[[2017,6,1]],"date-time":"2017-06-01T00:00:00Z","timestamp":1496275200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2017,6,1]],"date-time":"2017-06-01T00:00:00Z","timestamp":1496275200000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2017,6,1]],"date-time":"2017-06-01T00:00:00Z","timestamp":1496275200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2017,6,1]],"date-time":"2017-06-01T00:00:00Z","timestamp":1496275200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000001","name":"NSF","doi-asserted-by":"publisher","award":["CNS-1319904"],"award-info":[{"award-number":["CNS-1319904"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100000001","name":"NSF","doi-asserted-by":"publisher","award":["CNS-1319718"],"award-info":[{"award-number":["CNS-1319718"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100000001","name":"NSF","doi-asserted-by":"publisher","award":["CNS-1319784"],"award-info":[{"award-number":["CNS-1319784"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Sandia National Laboratory"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2017,6]]},"DOI":"10.1109\/tvlsi.2017.2669144","type":"journal-article","created":{"date-parts":[[2017,3,11]],"date-time":"2017-03-11T02:26:13Z","timestamp":1489199173000},"page":"1895-1905","source":"Crossref","is-referenced-by-count":53,"title":["Improving System-Level Lifetime Reliability of Multicore Soft Real-Time Systems"],"prefix":"10.1109","volume":"25","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-8413-000X","authenticated-orcid":false,"given":"Yue","family":"Ma","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Thidapat","family":"Chantem","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Robert P.","family":"Dick","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiaobo Sharon","family":"Hu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref38","year":"2016","journal-title":"Connectland 1504002 Heatsink"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2005.73"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1145\/2742060.2742113"},{"key":"ref31","article-title":"Multilevel interconnect reliability on the effects of electro-thermomechanical stresses","author":"nguyen","year":"2004"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1145\/321738.321743"},{"key":"ref37","year":"2016","journal-title":"Technical Brief of NVIDIA Jetson TK1 Development Kit"},{"key":"ref36","year":"2016","journal-title":"Cvxopt - Python Software for Convex Optimization"},{"key":"ref35","year":"2016","journal-title":"Interior-Point Convex Quadratic Programming Solver"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/ECCTD.2009.5275073"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2015.7372658"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.281"},{"key":"ref12","first-page":"51","article-title":"Lifetime reliability-aware task allocation and scheduling for MPSoC platforms","author":"huang","year":"2009","journal-title":"Proc Design Autom Test Eur Conf Exhibition (DATE)"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2011.132"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.149"},{"key":"ref15","first-page":"1","article-title":"Temperature aware energy-reliability trade-offs for mapping of throughput-constrained applications on multimedia MPSoCs","author":"das","year":"2014","journal-title":"Proc Design Autom Test Eur Conf Exhibition (DATE)"},{"key":"ref16","first-page":"1","article-title":"A Linux-governor based dynamic reliability manager for Android mobile devices","author":"mercati","year":"2014","journal-title":"Proc Design Autom Test Eur Conf Exhibition (DATE)"},{"key":"ref17","first-page":"1","article-title":"Combined DVFS and mapping exploration for lifetime and soft-error susceptibility improvement in MPSoCs","author":"das","year":"2014","journal-title":"Proc Design Autom Test Eur Conf Exhibition (DATE)"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/1878961.1878987"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1145\/2380445.2380455"},{"key":"ref28","first-page":"804","article-title":"Lifetime-Aware Load Distribution Policies in Multi-Core Systems: An In-Depth Analysis","author":"cristiana bolchini","year":"2016","journal-title":"Design Automation Test in Europe Conference Exhibition (DATE)"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2011.5763083"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1145\/2800986.2800992"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/RTAS.2009.34"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/2380356.2380379"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1145\/980152.980157"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2058873"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2010.2052057"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/1594233.1594257"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/DSN.2004.1311888"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/2024724.2024811"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/1878961.1879013"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2016.7428091"},{"key":"ref22","year":"2016","journal-title":"Jetson Tegra K1"},{"key":"ref21","first-page":"1","article-title":"Reinforcement learning-based inter- and intra-application thermal optimization for lifetime improvement of multicore systems","author":"das","year":"2015","journal-title":"Proc 51st Annu Design Autom Conf"},{"key":"ref24","first-page":"187","article-title":"The case for microarchitecture awareness of lifetime reliability","author":"srinivasan","year":"2004","journal-title":"Proc Int Symp Comp Arch"},{"key":"ref23","year":"2016","journal-title":"MiBench"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/DFT.2013.6653583"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1145\/1127908.1127933"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/ieeexplore.ieee.org\/ielaam\/92\/7932577\/7875431-aam.pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/7932577\/07875431.pdf?arnumber=7875431","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,4,8]],"date-time":"2022-04-08T18:48:34Z","timestamp":1649443714000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7875431\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,6]]},"references-count":38,"journal-issue":{"issue":"6"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2017.2669144","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2017,6]]}}}