{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,5]],"date-time":"2026-03-05T15:29:54Z","timestamp":1772724594833,"version":"3.50.1"},"reference-count":30,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2018,2,1]],"date-time":"2018-02-01T00:00:00Z","timestamp":1517443200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2018,2]]},"DOI":"10.1109\/tvlsi.2017.2760010","type":"journal-article","created":{"date-parts":[[2017,10,27]],"date-time":"2017-10-27T18:41:49Z","timestamp":1509129709000},"page":"367-377","source":"Crossref","is-referenced-by-count":17,"title":["Fast Analysis of Time Interval Error in Current-Mode Drivers"],"prefix":"10.1109","volume":"26","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-9109-2948","authenticated-orcid":false,"given":"Jai Narayan","family":"Tripathi","sequence":"first","affiliation":[]},{"given":"Ramachandra","family":"Achar","sequence":"additional","affiliation":[]},{"given":"Rakesh","family":"Malik","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref30","author":"bracewell","year":"1999","journal-title":"The Fourier Transform and Its Applications"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2013.2250506"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2332189"},{"key":"ref12","first-page":"968","article-title":"Modeling and analysis of power supply noise effects on analog-to-digital converter in 3DIC","author":"bae","year":"2011","journal-title":"Proc 8th Workshop Electromagn Compat Integr Circuits (EMC Compo)"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2011.6038348"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2013.2295933"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2014.6898945"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2015.2403294"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2015.2450723"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/EPEP.2007.4387157"},{"key":"ref19","first-page":"43","article-title":"Modeling and measurement of supply noise induced jitter in a 12.8 Gbps single-ended memory interface","author":"lan","year":"2012","journal-title":"Proc IEEE Conf Electr Performance Electron Packag Syst"},{"key":"ref28","author":"rabaey","year":"2002","journal-title":"Digital Integrated Circuits"},{"key":"ref4","author":"johnson","year":"1993","journal-title":"High Speed Digital Design A Handbook of Black Magic"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2017.2711480"},{"key":"ref3","author":"li","year":"2007","journal-title":"Jitter Noise and Signal Integrity at High-Speed"},{"key":"ref6","first-page":"1","article-title":"On-chip power supply noise and reliability analysis for multi-gigabit I\/O interfaces","author":"schmitt","year":"2010","journal-title":"Proc DesignCon"},{"key":"ref29","year":"2017","journal-title":"Advanced Design System Version"},{"key":"ref5","author":"bogatin","year":"2009","journal-title":"Signal and Power Integrity"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TMC.2003.1255645"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2011.2182194"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-28522-6_2"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2010.2047395"},{"key":"ref1","author":"swaminathan","year":"2007","journal-title":"Power Integrity Modeling and Design for Semiconductors and Systems"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2010.5450490"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2014.6899082"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2014.6899021"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2016.2517635"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/EMCSI.2015.7107652"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/SOCC.2015.7406926"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/SaPIW.2016.7496259"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/8263418\/08088362.pdf?arnumber=8088362","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:27:23Z","timestamp":1642004843000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8088362\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,2]]},"references-count":30,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2017.2760010","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2018,2]]}}}