{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T10:21:08Z","timestamp":1740133268745,"version":"3.37.3"},"reference-count":19,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2019,3]]},"DOI":"10.1109\/tvlsi.2018.2880923","type":"journal-article","created":{"date-parts":[[2018,12,5]],"date-time":"2018-12-05T20:12:25Z","timestamp":1544040745000},"page":"587-600","source":"Crossref","is-referenced-by-count":1,"title":["What Is the Maximum Achievable Oscillation Frequency in a Specified CMOS Process?"],"prefix":"10.1109","volume":"27","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-2117-5868","authenticated-orcid":false,"given":"Amard","family":"Afzalian","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3093-4958","authenticated-orcid":false,"given":"Hossein","family":"Miar-Naimi","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2884-7062","authenticated-orcid":false,"given":"Massoud","family":"Dousti","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/81.331530"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.2001878"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2108122"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2017.2702116"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2319251"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCT.1954.1083579"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TTHZ.2011.2181922"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1007\/s10470-014-0312-2"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2015.2459688"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1080\/00207217.2018.1440424"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2726100"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2010.2073910"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2012.2230019"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2104553"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2011.2143270"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2016.2563718"},{"journal-title":"RF Microelectronics","year":"2012","author":"razavi","key":"ref2"},{"journal-title":"Microwave Engineering","year":"2012","author":"pozar","key":"ref1"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2272864"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/8649697\/08561170.pdf?arnumber=8561170","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,13]],"date-time":"2022-07-13T21:10:23Z","timestamp":1657746623000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8561170\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,3]]},"references-count":19,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2018.2880923","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"type":"print","value":"1063-8210"},{"type":"electronic","value":"1557-9999"}],"subject":[],"published":{"date-parts":[[2019,3]]}}}