{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T10:21:13Z","timestamp":1740133273174,"version":"3.37.3"},"reference-count":21,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"7","license":[{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100004663","name":"Ministry of Science and Technology, Taiwan","doi-asserted-by":"publisher","award":["MOST 105-2221-E-003-001-MY2","MOST 107-2221-E-003-003"],"award-info":[{"award-number":["MOST 105-2221-E-003-001-MY2","MOST 107-2221-E-003-003"]}],"id":[{"id":"10.13039\/501100004663","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2019,7]]},"DOI":"10.1109\/tvlsi.2019.2908956","type":"journal-article","created":{"date-parts":[[2019,4,27]],"date-time":"2019-04-27T05:01:47Z","timestamp":1556341307000},"page":"1527-1536","source":"Crossref","is-referenced-by-count":5,"title":["Design of a 5.3-GHz 31.3-dBm Fully Integrated CMOS Power Amplifier Using Folded Splitting and Combining Architecture"],"prefix":"10.1109","volume":"27","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-8324-7249","authenticated-orcid":false,"given":"Jeng-Han","family":"Tsai","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","first-page":"1","article-title":"5-GHz transformer combined class-\n$\\text{F}^{-1}$\n power amplifier","author":"nai","year":"2016","journal-title":"Proc IEEE Int Symp Radio-Freq Integr Technol (RFIT)"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.920347"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2041401"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2399458"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2017.2691766"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/22.981284"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.920349"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2013.2238245"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2180977"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2016.2623781"},{"key":"ref4","first-page":"2036","article-title":"IEEE 802.11p: Towards an international standard for wireless access in vehicular environments","author":"jiang","year":"2008","journal-title":"Proc IEEE Veh Technol Conf"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MWC.2016.7422404"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2012.2193898"},{"key":"ref5","first-page":"1","article-title":"A linear 5.9 GHz power amplifier for IEEE 802.11p applications","author":"lin","year":"2015","journal-title":"Proc IEEE Int Workshop Electromagn Appl Stud Innov Competition (iWEM)"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2006.249780"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2004.837080"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/WCNCW.2015.7122583"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/DySPAN.2015.7343904"},{"key":"ref9","first-page":"88","article-title":"A 30.3 dBm 1.9 GHz-bandwidth \n$2\\times4$\n-array stacked 5.3 GHz CMOS power amplifier","author":"fathi","year":"2013","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2015.2427578"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2018.2801806"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/8746725\/08695840.pdf?arnumber=8695840","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,13]],"date-time":"2022-07-13T20:53:56Z","timestamp":1657745636000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8695840\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,7]]},"references-count":21,"journal-issue":{"issue":"7"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2019.2908956","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"type":"print","value":"1063-8210"},{"type":"electronic","value":"1557-9999"}],"subject":[],"published":{"date-parts":[[2019,7]]}}}