{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,29]],"date-time":"2026-08-29T15:39:06Z","timestamp":1788017946921,"version":"build-2784847793"},"reference-count":13,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"7","license":[{"start":{"date-parts":[[2021,7,1]],"date-time":"2021-07-01T00:00:00Z","timestamp":1625097600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2021,7]]},"DOI":"10.1109\/tvlsi.2021.3076593","type":"journal-article","created":{"date-parts":[[2021,5,27]],"date-time":"2021-05-27T23:26:40Z","timestamp":1622158000000},"page":"1475-1479","source":"Crossref","is-referenced-by-count":5,"title":["Graceful Degradation of Reconfigurable Scan Networks"],"prefix":"10.1109","volume":"29","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-6672-0279","authenticated-orcid":false,"given":"Erik","family":"Larsson","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zehang","family":"Xiang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Prathamesh","family":"Murali","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/92.335019"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2008.83"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2009.74"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2018.2834915"},{"key":"ref4","year":"2016"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IEEESTD.2014.6974961"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2011.155"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ITC44170.2019.9000135"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ETS.2016.7519288"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2011.5763228"},{"key":"ref2","first-page":"1","article-title":"Component manufacturer perspective","author":"posse","year":"2015","journal-title":"Proc Int Test Conf"},{"key":"ref1","first-page":"20","year":"2010","journal-title":"Embedded Instrumentation Its Importance and Adoption in the Test & Measurement Marketplace"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ReCoSoC.2011.5981520"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/9466377\/09442850.pdf?arnumber=9442850","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,12,17]],"date-time":"2021-12-17T20:02:41Z","timestamp":1639771361000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9442850\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,7]]},"references-count":13,"journal-issue":{"issue":"7"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2021.3076593","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021,7]]}}}