{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,7]],"date-time":"2026-09-07T19:09:35Z","timestamp":1788808175672,"version":"build-2803163510"},"reference-count":36,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2021,12,1]],"date-time":"2021-12-01T00:00:00Z","timestamp":1638316800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,12,1]],"date-time":"2021-12-01T00:00:00Z","timestamp":1638316800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,12,1]],"date-time":"2021-12-01T00:00:00Z","timestamp":1638316800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Department of Computer Engineering, Taibah University, Saudi Arabia"},{"name":"Department of Electrical Engineering and Electronics"},{"name":"ODA Research Seed Funding, University of Liverpool, U.K."},{"name":"Consejo Nacional de Cienciay Tecnolog\u00eda, Mexico"},{"name":"Italian Ministry of Education and Research in the framework of the CrossLab Project"},{"name":"Department of Information Engineering, University of Pisa, Italy"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2021,12]]},"DOI":"10.1109\/tvlsi.2021.3115247","type":"journal-article","created":{"date-parts":[[2021,10,7]],"date-time":"2021-10-07T20:14:58Z","timestamp":1633637698000},"page":"2064-2075","source":"Crossref","is-referenced-by-count":14,"title":["Differential Aging Sensor Using Subthreshold Leakage Current to Detect Recycled ICs"],"prefix":"10.1109","volume":"29","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-6884-4053","authenticated-orcid":false,"given":"Turki","family":"Alnuayri","sequence":"first","affiliation":[{"name":"Taibah University","place":["Medina, Saudi Arabia"],"department":["Department of Computer Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Saqib","family":"Khursheed","sequence":"additional","affiliation":[{"name":"University of Liverpool","place":["Liverpool, U.K."],"department":["Department of Electrical Engineering and Electronics"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4341-6861","authenticated-orcid":false,"given":"Antonio Leonel Hernandez","family":"Martinez","sequence":"additional","affiliation":[{"name":"University of Liverpool","place":["Liverpool, U.K."],"department":["Department of Electrical Engineering and Electronics"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9487-378X","authenticated-orcid":false,"given":"Daniele","family":"Rossi","sequence":"additional","affiliation":[{"name":"University of Pisa","place":["Pisa, Italy"],"department":["Department of Information Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref33","year":"2019","journal-title":"Model Reference Guide—Aging Unpublished–Confidential"},{"key":"ref32","year":"2004"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.2991\/icamia-15.2015.6"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-25766-2_4"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/ETS.2011.63"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2239319"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2013.2240390"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.vlsi.2019.02.006"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2015.2466551"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-013-5428-2"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ETS.2018.8400713"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/DFT.2012.6378192"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2008.4523231"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.917502"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2040125"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2160813"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2010.5433994"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-540-30205-6_5"},{"key":"ref4","article-title":"Electronics supply chain","author":"bhunia","year":"2018","journal-title":"Hardware Security A Hands-on Learning Approach"},{"key":"ref27","article-title":"Understanding power consumption fundamentals","author":"mishra","year":"2015","journal-title":"System on Chip Interfaces for Low Power Design"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2014.2332291"},{"key":"ref6","year":"2020","journal-title":"Defense Industrial Base Assessment Counterfeit Electronics"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2626218"},{"key":"ref5","year":"2020","journal-title":"Reports of Counterfeit Parts Quadruple Since 2009 Challenging U S Defense Industry and National Security"},{"key":"ref8","year":"2020","journal-title":"Top 5 Most Counterfeited Parts Represent A $169 Billion Potential Challenge for Global Semiconductor Market"},{"key":"ref7","year":"2020","journal-title":"Electronics Waste Management in the United States Through 2009"},{"key":"ref2","author":"forte","year":"2020","journal-title":"Counterfeit Integrated Circuits Threats Detection and Avoidance"},{"key":"ref9","year":"2021","journal-title":"One Counterfeit Part Every 15 Seconds"},{"key":"ref1","doi-asserted-by":"crossref","DOI":"10.1007\/978-3-319-11824-6","author":"tehranipoor","year":"2015","journal-title":"Counterfeit Integrated Circuits - Detection and Avoidance"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228486"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2018.8383917"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2264063"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2519385"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.23919\/DATE51398.2021.9473975"},{"key":"ref26","first-page":"1","article-title":"Leakage current in sub-micrometer CMOS gates","author":"butzen","year":"2006"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2016.2561206"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/9627316\/09563093.pdf?arnumber=9563093","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,9,7]],"date-time":"2026-09-07T19:02:51Z","timestamp":1788807771000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9563093\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,12]]},"references-count":36,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2021.3115247","relation":{},"ISSN":["1557-9999","1063-8210"],"issn-type":[{"value":"1557-9999","type":"electronic"},{"value":"1063-8210","type":"print"}],"subject":[],"published":{"date-parts":[[2021,12]]}}}