{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,28]],"date-time":"2026-03-28T16:45:15Z","timestamp":1774716315866,"version":"3.50.1"},"reference-count":15,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2022,2,1]],"date-time":"2022-02-01T00:00:00Z","timestamp":1643673600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,2,1]],"date-time":"2022-02-01T00:00:00Z","timestamp":1643673600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,2,1]],"date-time":"2022-02-01T00:00:00Z","timestamp":1643673600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Israel Innovation Authority"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2022,2]]},"DOI":"10.1109\/tvlsi.2021.3137338","type":"journal-article","created":{"date-parts":[[2022,1,26]],"date-time":"2022-01-26T05:28:24Z","timestamp":1643174904000},"page":"248-252","source":"Crossref","is-referenced-by-count":20,"title":["A 700-<i>\u03bc<\/i>m\u00b2, Ring-Oscillator-Based Thermal Sensor in 16-nm FinFET"],"prefix":"10.1109","volume":"30","author":[{"given":"Yosef","family":"Lempel","sequence":"first","affiliation":[]},{"given":"Rinat","family":"Breuer","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9184-8642","authenticated-orcid":false,"given":"Joseph","family":"Shor","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2020.3029852"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2396522"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2010.5537829"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2598765"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310312"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2018.2797427"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3105039"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2952855"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2646798"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2020.3005784"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2019.2938140"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.2987595"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2020.2999494"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.1997.606696"},{"key":"ref15","volume-title":"Temperature Sensor Performance Survey","author":"Makinwa"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/9705196\/09679373.pdf?arnumber=9679373","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,13]],"date-time":"2024-01-13T22:30:17Z","timestamp":1705185017000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9679373\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,2]]},"references-count":15,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tvlsi.2021.3137338","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,2]]}}}